ATS-P2-75-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.95°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are used to dissipate heat away from electronic components and reduce their temperature. A heat sink is typically made of metal with a finned surface that increases the surface area and helps dissipate the heat into the surrounding air or environment more efficiently. This article will discuss the application field and working principle of the ATS-P2-75-C1-R0 thermal heat sink.

Application Field

The ATS-P2-75-C1-R0 thermal heat sink is designed to maintain your electronic components within safe temperature limits, all while saving valuable space within any electronics project. It can be used in a wide range of applications such as telecommunications, data center systems, industrial equipment, and consumer electronics. ATS thermal heat sinks are designed for cooling power electronics such as FET, IGBT, SCR, and Diodes, as well as microprocessors, SMD LEDs, and general electronics. The ATS-P2-75-C1-R0 is compatible with many current popular IC packages such as SOT, SOIC, QFN, DPAK, TO-220, TO-126, and TO-254. In addition to this, it is also an ideal choice for highspeed data transmission, 5G applications, and high-power, wide-temperature machines.

Installation

Installation of the ATS-P2-75-C1-R0 thermal heat sink is simple and easy to do. The first step is to make sure the thermal paste you will be using is adequate for the application, the correct type will vary depending on the operating temperature of the unit. Then, using a thermal pad or inverted heat spreader, apply the thermal paste onto the base of the heat sink and onto the components that need to be cooled. Ensure that the thermal paste covers the contact surfaces completely. Next, align the bottom of the heat sink with the components that need cooling, and secure it using the mounting hardware. Some heat sinks come with pre-drilled holes for mounting plate screws, or you can also use adhesive pads or thermal adhesive for more permanent mounting options. For fan cooled heat sinks, make sure to orient the fan’s airflow in the right direction for maximum cooling efficiency.

Working Principle

The ATS-P2-75-C1-R0 thermal heat sink works on the principle of increasing the surface area of the heat sink to increase the air flow around the device and to increase the rate of heat transfer between the two surfaces. When the unit is powered on, the heat generated by the component transfers to the metal fins of the heat sink, and the heat is then dissipated into the surrounding air.To further enhance the cooling performance of the heat sink, ATS also offers a variety of air cooled fans and liquid cooling pumps which can be used to blow or circulate cool air over the heat sink, thus increasing the rate of heat transfer between the heat sink and the ambient temperature.

Conclusion

The ATS-P2-75-C1-R0 thermal heat sink is a cost effective and reliable solution for cooling a wide variety of electronic components. It is designed to maintain safe temperature levels while saving valuable space in any electronics project. The installation of this product is simple and easy, and the working principle is based on increasing the surface area of the heat sink to facilitate the transfer of heat. With its wide range of compatible packages and reliable cooling performance, the ATS-P2-75-C1-R0 is an ideal choice for any application.

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