| Allicdata Part #: | ATS-P2-78-C3-R0-ND |
| Manufacturer Part#: |
ATS-P2-78-C3-R0 |
| Price: | $ 4.10 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-78-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.72456 |
| 30 +: | $ 3.51750 |
| 50 +: | $ 3.31065 |
| 100 +: | $ 3.10376 |
| 250 +: | $ 2.89684 |
| 500 +: | $ 2.68992 |
| 1000 +: | $ 2.63820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.98°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
A Thermal - Heat Sink is a special type of heat-dissipating device that is designed to transfer and dissipate the heat generated by electronic and mechanical components to the surrounding environment, thereby avoiding overheating or damage. The ATS-P2-78-C3-R0 Heat Sink is one of the most popular types of devices currently used in the industry for heat dissipation. It is widely used in applications ranging from industrial to consumer goods.
The ATS-P2-78-C3-R0 Heat Sink is a two-piece aluminum block, which consists of a base plate and a heat sink. The base plate is generally made of a higher grade aluminum that is more thermally conductive than the softer aluminum used for the heat sink. This two-piece design provides a very effective thermal interface that allows heat to be readily transferred from the device to the heat sink. The base plate also serves to support the weight of the component.
To dissipate the heat generated by electronic components, the ATS-P2-78-C3-R0 Heat Sink utilizes copper fins. These fins are designed to have maximum surface area exposed to the environment, allowing for faster heat transfer. The fins are also designed to be closely spaced, minimizing air resistance and turbulence created by moving air around the fins, which in turn increases the efficiency of heat dissipation. The heat is then conducted away from the components through a combination of conduction and convection.
The ATS-P2-78-C3-R0 Heat Sink is also designed to be highly customizable and modular. It is easy to assemble from pre-fabricated or custom-made parts, and its shape can be altered easily to accommodate different components. This allows designers to create a thermal solution for their particular application. Additionally, the heat sink can also be used in combination with other cooling systems such as pumps, fans, and cold plates.
The ATS-P2-78-C3-R0 Heat Sink is extremely durable and reliable when used in its recommended applications. It can withstand the extreme temperatures and vibrations common in industrial and consumer environments. The device can even maintain an optimal operating temperature in the most extreme conditions. It is also designed to ensure the longevity of the components to which it is attached, providing years of reliable performance.
Whether for industrial or consumer applications, the ATS-P2-78-C3-R0 Heat Sink provides an efficient and reliable thermal solution for all types of electronic and mechanical components. Its modular design provides flexibility to fit any application, ensuring optimal performance regardless of what the environment throws at it. With its superior heat dissipation and durability, the ATS-P2-78-C3-R0 Heat Sink is an ideal choice for those who need to protect their components from the hazardous effects of extreme temperatures.
The specific data is subject to PDF, and the above content is for reference