| Allicdata Part #: | ATS36752-ND |
| Manufacturer Part#: |
ATS-P2-80-C2-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-80-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.55320 |
| 10 +: | $ 3.45870 |
| 25 +: | $ 3.26642 |
| 50 +: | $ 3.07415 |
| 100 +: | $ 2.88206 |
| 250 +: | $ 2.68992 |
| 500 +: | $ 2.49779 |
| 1000 +: | $ 2.44975 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are physical components that are used to control the temperature of an electronic device. They are used to dissipate the heat generated by the device\'s electronics, allowing it to remain at a safe temperature level. One of the most popular heat sinks that is used today is the ATS-P2-80-C2-R0. This device is a low-profile and compact solution for controlling the temperature of an electronic device.
ATS-P2-80-C2-R0 Application Field
The ATS-P2-80-C2-R0 heat sink is used in a variety of applications. It is most commonly used with mobile devices, such as smartphones and tablets, as well as laptops. It can also be used in automotive, medical, and consumer electronics applications. It is designed to reduce the temperature of a device by up to 10°C, and can be used with any electronic device.
ATS-P2-80-C2-R0 Working Principle
The ATS-P2-80-C2-R0 heat sink works on the principle of thermodynamics, which is the study of heat transfer between two materials. The heat sink consists of two layers. The first layer is a heat-conducting material, such as aluminum, that has a large surface area. This material is designed to absorb the heat generated by the electronic device and dissipate it away from the device. The second layer is a thermal insulation material, which helps prevent the heat from radiating back into the device.
The heat generated by the device is absorbed by the heat-conducting layer and dissipated away from the device. This process is known as convection, and it ensures that the device remains at a safe temperature level. The thermal insulation layer also helps reduce the amount of heat that is released into the ambient air around the device.
Conclusion
The ATS-P2-80-C2-R0 heat sink is a low-profile, compact solution for controlling the temperature of an electronic device. It is designed to reduce the temperature of the device by up to 10°C, and is used in a variety of applications. The heat sink works on the principle of thermodynamics, and consists of two layers - a heat-conducting material and a thermal insulation layer. This ensures that the device remains at a safe temperature level, while also reducing the amount of heat released into the ambient air around the device.
The specific data is subject to PDF, and the above content is for reference