| Allicdata Part #: | ATS-P2-82-C3-R0-ND |
| Manufacturer Part#: |
ATS-P2-82-C3-R0 |
| Price: | $ 3.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-82-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.53934 |
| 30 +: | $ 3.34278 |
| 50 +: | $ 3.14622 |
| 100 +: | $ 2.94953 |
| 250 +: | $ 2.75290 |
| 500 +: | $ 2.55626 |
| 1000 +: | $ 2.50711 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a crucial aspect of electronic system design that helps to provide efficient, reliable, and cool operations. Heat sinks are the most common type of thermal management solution in today’s electronic systems. Heat sinks dissipate heat by taking advantage of their thermal conductivity and create convection by utilizing air flow over their fins to draw away the hot air. The ATS-P2-82-C3-R0 is a high-performance, low-profile heat sink designed specifically for thermal control applications in products such as computers and server-based systems.
The ATS-P2-82-C3-R0 is an extruded heatsink made up of anodized aluminum. Measuring just 82mm x 82mm x 30mm, the ATS-P2-82-C3-R0 is an ideal solution for a variety of electronic applications. It has six fins with a combined area of 13,520 mm2 and a total weight of just 204 grams. The ATS-P2-82-C3-R0 also features integrated heat pipes that allow heat to be dissipated rapidly and efficiently from the heat source while maintaining a low profile.
The ATS-P2-82-C3-R0 has been designed to provide superior thermal performance, allowing it to remove up to 75W of heat energy. It is capable of dissipating the heat from multiple component sources with an average thermal resistance of just 0.22 °C/W. The maximum ambient operating temperature is +70°C. Additionally, this heat sink is also suitable for a wide range of processor models and is compatible with standard mounting screws.
The ATS-P2-82-C3-R0 works on the principles of convection and thermal conduction. Heat naturally moves from a high temperature source to a lower temperature sink. In this case, heat leaves the processor and is spread out across the fins, becoming evenly distributed to ensure superior thermal performance. This heat is then swept away from the device by the natural circulation of air which is further enhanced by the integrated heat pipes.
The ATS-P2-82-C3-R0 is a powerful heat sink solution for those looking for enhanced thermal performance in a compact form factor. Its combination of integrated heat pipes and anodized aluminum fins make it highly efficient in removing heat away from the sources and promoting maximum airflow. The ATS-P2-82-C3-R0 is ideal for challenging thermal applications in laptop and desktop computers, telecoms, networking equipment, and embedded control systems.
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