| Allicdata Part #: | ATS36759-ND |
| Manufacturer Part#: |
ATS-P2-87-C2-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-87-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.93750 |
| 10 +: | $ 3.82851 |
| 25 +: | $ 3.61595 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.16°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are becoming increasingly essential in the reliable operation of the modern day electronic equipment. Heat sinks effectively manage the heat produced by electronic components and provide a safe environment for these components.
The ATS-P2-87-C2-R0 heat sink is designed to serve the same purpose. It is optimized for the thermal cooling of mobile phones and data centers, as well as other applications that require both cooling and performance. Its compact size and efficient thermal design make it the perfect choice for a wide range of applications.
The ATS-P2-87-C2-R0 works by dissipating the heat generated by the components in the electronic equipment. The heat sink has a finned aluminum base and a fan mounted above the heat sink. The fan circulates air over the fins to help prevent the excess heat buildup.
The fins contain many air channels for maximum air flow and heat exchange. The fan is specially designed to ensure maximum air velocity and airflow. The fan pushes the displaced heat away from the component and out of the system.
The ATS-P2-87-C2-R0 also utilizes a passive thermal transfer material between its base and the heat-generating component. This material helps to dissipate heat faster and is much more efficient than traditional materials used in heat sinks.
The ATS-P2-87-C2-R0 is ideal for applications with complete air circulation where cooling components are more difficult to achieve. Thanks to its low profile design, the heat sink still offers exceptional cooling performance in limited space. Thanks to its slim construction, it fits perfectly into slim enclosures.
The ATS-P2-87-C2-R0 is capable of cooling components with temperatures up to 180°F. It is compatible with 300-series microprocessors and can be used in multiple applications. It works well in application fields such as automotive, consumer electronics, aerospace, and industrial.
The ATS-P2-87-C2-R0 is designed to be maintenance-free and highly reliable. It comes with a thermal guidance tool for improved heat sink performance. The tool helps to identify the best cooling solutions for the application field.
The ATS-P2-87-C2-R0 heat sink is an ideal choice for applications that require both cooling and performance. Its high-performance, low-profile construction and efficient thermal design make it the perfect heating and cooling solution for a variety of different application fields. With its innovative design and superior cooling capabilities, the ATS-P2-87-C2-R0 thermal heat sink is an excellent choice for any application needing reliable thermal management.
The specific data is subject to PDF, and the above content is for reference