| Allicdata Part #: | ATS2053-ND |
| Manufacturer Part#: |
ATS-PCB1011 |
| Price: | $ 0.22 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK TO-220 DUAL MNT BLACK |
| More Detail: | Heat Sink TO-220 Aluminum Board Level |
| DataSheet: |  ATS-PCB1011 Datasheet/PDF |
| Quantity: | 1000 |
| 1000 +: | $ 0.19567 |
| 5000 +: | $ 0.18892 |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | TO-220 |
| Attachment Method: | Bolt On |
| Shape: | Rectangular, Fins |
| Length: | 1.189" (30.20mm) |
| Width: | 1.012" (25.70mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.496" (12.60mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 16.70°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are devices that absorb and dissipate excess heat generated by electronic components, thereby reducing their temperature and allowing them to function more efficiently. They are typically made of metal with fins orwave-shaped surfaces which increase the surface area exposed to the air, thus providing increased air circulation for better cooling. One of the most popular heat sinks is the ATS-PCB1011, an aluminum construction that is designed for use with power semiconductors, such as transistors and diodes.
The ATS-PCB1011 is an ideal heat sink for applications that require high power dissipation, such as high-end computer systems. It is designed to provide effective cooling for power devices, such as lasers, amplifiers, power supplies, and other industrial electronics. The ATS-PCB1011 is a compact and lightweight design that is easy to install and requires no special mounting hardware. It is constructed of an extruded aluminum plate, which provides a larger thermal dissipation surface than other types of heat sinks, enabling greater heat transfer rate and reduced risk of over-temperature conditions. The unit is protected from dust and other debris by a plastic cover, and it is also available with an optional integral fan for additional cooling.
The working principle of the ATS-PCB1011 is simple and effective. It uses convection to dissipate heat from the power semiconductors. As air passes over the heat sink’s finned surface, it absorbs the thermal energy from the device. This thermal energy is then dissipated into the surrounding air as heat. The greater the fin surface area, the more efficiently the heat is dissipated. The ATS-PCB1011 also features a built-in thermal diffusion layer, which helps to evenly distribute heat across the device\'s surface area.
The ATS-PCB1011 is a highly popular heat sink due to its low cost, lightweight design, and effective cooling performance. It is ideal for applications where a large number of power semiconductor devices must be cooled, such as in high-end computer systems. The ATS-PCB1011 is also perfect for applications where a fan is not needed or easily replaced due to its extruded aluminum construction and efficient convection cooling.
The specific data is subject to PDF, and the above content is for reference