ATS-PCB1017

Series:	--
Part Status:	Active
Type:	Board Level
Package Cooled:	TO-220, TO-202
Attachment Method:	Bolt On
Shape:	Rectangular, Fins
Length:	0.698" (17.74mm)
Width:	1.750" (44.45mm)
Diameter:	--
Height Off Base (Height of Fin):	0.371" (9.43mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.10°C/W @ 200 LFM
Thermal Resistance @ Natural:	15.60°C/W
Material:	Aluminum
Material Finish:	Black Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

Thermal - Heat Sinks are devices designed to dissipate and transfer heat away from an area by using an arrangement of fins and plates. The dissipation of heat in this manner prevents the component or system from overheating and malfunctioning. One of the most common types of heat sinks is the ATS-PCB1017, which is designed specifically for applications which require efficient heat transfer.

Description and Application of ATS-PCB1017

The ATS-PCB1017 heat sink is a passive device that consists of a large array of aluminum fins attached to an aluminum plate. The fins are arranged such that air flows smoothly over them in a manner that allows efficient convection cooling. The laminar flow design of the fins minimizes turbulence and guarantees optimal thermal performance and heat dissipation. The heat is dissipated to the environment by dissipating it via the laminar flow of air that is induced across the heat sink. The ATS-PCB1017 heat sink is specifically designed for cooling power electronic components and power devices. These components generate a lot of heat and require an effective heat sink solution for proper cooling. The ATS-PCB1017 is used in applications such as power inverters, voltage converters, smart grids, power controllers, and PFCs.

Construction and Features

The ATS-PCB1017 heat sink is constructed from aluminum which offers high thermal conductivity and durability. It features a large array of fins and plates that are precisely arranged to maximize convection cooling and reduce turbulence. The air intake holes are designed to direct air over the fins more efficiently. The heat sink also has an electrically isolated base plate which eliminates any risk of electric shock or ground loops. The base plate also provides for an easy way to mount the heat sink to a suitable enclosure.The thermal performance of the ATS-PCB1017 heat sink is unmatched. Its fin arrangement is designed to allow air to flow smoothly over the fins which in turn ensures maximum convection-cooling efficiency and heat transfer. It offers a thermal resistance of 0.14°C/W under turbulent flow conditions and 0.09°C/W under laminar flow conditions.

Working Principle

The ATS-PCB1017 relies on the principle of convection cooling to transfer heat away from the component or device that it is cooling. The heat generated by the component is first transferred to the aluminum fins which are arranged in such a way as to maximize convection cooling. The air flow across the fins is induced by the presence of the intake holes in the heat sink, and the air flow is further enhanced by the laminar flow of the fins. As the air is warmed by the fins, it rises, creating a vacuum which draws in more air to create a convection loop. This process allows for efficient thermal transfer by dissipating the heat to the environment.

Conclusion

The ATS-PCB1017 heat sink is a highly efficient device designed specifically for cooling applications which require an effective heat transfer solution. It features an expansive array of aluminum fins which reduces turbulence and ensures maximum convection cooling. The electrically isolated base plate makes installation and mounting easy and also eliminates any risk of electric shock or ground loops. The thermal resistance offered is unrivaled with a rate of 0.14°C/W under turbulent flow conditions and 0.09°C/W in laminar flow conditions. The ATS-PCB1017 heat sink is an ideal solution for powering electronic components and power devices.

The specific data is subject to PDF, and the above content is for reference