ATS-PCB1026 Allicdata Electronics
Allicdata Part #:

ATS2068-ND

Manufacturer Part#:

ATS-PCB1026

Price: $ 0.20
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK TO-220 DUAL
More Detail: Heat Sink TO-220 Aluminum Board Level
DataSheet: ATS-PCB1026 datasheetATS-PCB1026 Datasheet/PDF
Quantity: 1000
1000 +: $ 0.17704
5000 +: $ 0.17093
Stock 1000Can Ship Immediately
$ 0.2
Specifications
Series: --
Part Status: Active
Type: Board Level
Package Cooled: TO-220
Attachment Method: Bolt On
Shape: Rectangular, Fins
Length: 1.181" (30.00mm)
Width: 1.106" (28.10mm)
Diameter: --
Height Off Base (Height of Fin): 0.905" (23.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

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The ATS-PCB1026 is a thermal management device. It comprises of a combination of thermally conductive substrates, thermally conductive jackets and thermal subsystems. As such, the device is ideal for applications that require maximum transfer of power and temperatures from the various components to the environment. It is designed to reduce thermal resistance and improve thermal efficiency. In this instance, the application is for a server environment and thus the thermal efficiency needs to be increased.

The thermal system is comprised of a combination of materials, and all of these materials have different properties, such as conductivity, thermal resistance, thermal expansion, surface area, etc. These materials can be selected according to the requirements of the application and the thermal performance that needs to be achieved.

The application of ATS-PCB1026 is for high power applications. It provides the necessary cooling to the servers with a maximum allowable temperature that is lower than the optimum temperature for operation of the system. The thermal system reduces the maximum thermal resistance arising from the component in the system. The thermal performance is improved by the use of the thermal conductive jackets and the substrates.

Basically, the working principle of ATS-PCB1026 is that of heat transfer. Heat is generated by the electronic components as power is drawn from it. Since air has poor heat transfer, the heat generated will remain trapped around the components. The thermal jackets and substrates provide better heat transfer to the environment which allows for cooling of the components.

To ensure that it provides maximum efficiency, the components placed in the ATS-PCB1026 should be tightly packed. This, increases the surface area and the velocity for the transfer of heat. Furthermore, as the materials used in the ATS-PCB1026 device do not expand or deform, they can reduce thermal resistance and improve thermal stability.

Apart from the servers, ATS-PCB1026 can also be used in the automobiles. The device helps to prevent the car from having issues related to poor heat transfer and temperature control, as it provides better thermal transfer. The device can also be used in medical electronics such as patient monitors and other medical devices that require efficient thermal management.

The ATS-PCB1026 thermal management system is an excellent example of a thermal-heat sink. It provides high efficiency in thermal transfer and cooling of the electronic components and therefore is suitable for applications where tight temperature profiles are required. By selecting suitable substrates and jackets, it can accelerate the cooling process. Its flexibility makes it an ideal solution for various applications.

The specific data is subject to PDF, and the above content is for reference

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