| Allicdata Part #: | ATS2075-ND |
| Manufacturer Part#: |
ATS-PCB1033 |
| Price: | $ 0.46 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK CLIP-ON TO-220 W/TAB |
| More Detail: | Heat Sink TO-220 Aluminum Board Level, Vertical |
| DataSheet: |  ATS-PCB1033 Datasheet/PDF |
| Quantity: | 2995 |
| 1 +: | $ 0.41580 |
| 10 +: | $ 0.39438 |
| 25 +: | $ 0.37472 |
| 50 +: | $ 0.36490 |
| 100 +: | $ 0.35998 |
| 250 +: | $ 0.33534 |
| 500 +: | $ 0.31561 |
| 1000 +: | $ 0.28602 |
| 5000 +: | $ 0.27615 |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | Bolt On and PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 0.850" (21.59mm) |
| Width: | 1.000" (25.40mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 20.00°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management is a critical component of the proper operation of most electronic components and assemblies, including ATS-PCB1033. In order for the electronic components to remain safe and operational, proper management of heat must be taken into account. The ATS-PCB1033 is a heat sink designed specifically for thermal management of these electronic components.
The ATS-PCB1033 is a type of heat sink, which is commonly used for cooling or dissipating the heat generated by electrical components. The heat sink consists of a metal base, usually of anodized aluminum, which is attached to several fins or air fins. These fins are designed to spread the heat generated by the component over a larger surface area, allowing it to dissipate quickly and evenly. The surface of the heat sink is typically textured, giving it increased surface area for heat dissipation. The fins are designed in such a way that their profiles are shaped to optimize air flow around the heat sink, helping to dissipate the heat generated by the component.
The ATS-PCB1033 is used in a variety of applications. In personal computing, the heat sink is used to dissipate the high levels of heat created by the central processing unit (CPU) and other components. In telecommunications, it is used to cool the sensitive and heat-producing RF components. The heat sink is also used in a variety of solid state devices such as linear amplifiers, diodes, transistors, LEDs, and optocouplers.
The working principle of the ATS-PCB1033 is fairly simple. When an electrical component generates heat, the heat is transferred to the fins of the heat sink. As the fins get hot, air is drawn in from surrounding areas. This air then passes through the fins, taking the heat with it and dissipating it into the atmosphere. This way, the heat is drawn away from the component and kept at safe levels.
In order for the ATS-PCB1033 to be an effective heat sink, it requires proper installation. It should be mounted to the component with the correct amount of heat sink compound applied, as well as the correct amount of screws. It should also be properly insulated from the component to ensure that the heat transfer is maximized. It is also important to make sure that there is enough space around the heat sink to allow the air to move freely in and out of the fins.
The ATS-PCB1033 is a reliable and efficient heat sink, making it a great choice for cooling and dissipating heat generated by electronic components. With proper installation and maintenance, the ATS-PCB1033 can help keep components safe and operating efficiently.
The specific data is subject to PDF, and the above content is for reference