| Allicdata Part #: | ATS2097-ND |
| Manufacturer Part#: |
ATS-PCB1055 |
| Price: | $ 0.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK TO-220 ALUMINUM |
| More Detail: | Heat Sink TO-220 Aluminum Board Level, Vertical |
| DataSheet: |  ATS-PCB1055 Datasheet/PDF |
| Quantity: | 983 |
| 1 +: | $ 0.76230 |
| 10 +: | $ 0.72513 |
| 25 +: | $ 0.70636 |
| 50 +: | $ 0.68720 |
| 100 +: | $ 0.64903 |
| 250 +: | $ 0.61085 |
| 500 +: | $ 0.57267 |
| 1000 +: | $ 0.53449 |
| 5000 +: | $ 0.51540 |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 0.748" (19.00mm) |
| Width: | 0.866" (22.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.433" (11.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.20°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 23.70°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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The ATS-PCB1055 is a type of thermal-heat sink typically used in high-power applications. It is designed to dissipate excess heat and prevent a device from overheating. Its construction consists of an aluminum base plate (typically anodized or passivated to avoid oxidation) and multiple fins attached to the plate, allowing for greater thermal dissipation. It is often found in applications such as semiconductor power amplifiers, photovoltaic cells, and other electronic components that require large amounts of heat to be dissipated.
The working principle of the thermal-heat sink is fairly simple. Heat generated from a device is dissipated by the fins connected to the aluminum base plate. The air flowing around the fins then carries away the heat. This is known as convection cooling. The more fins a sink has, the better its cooling ability, since more fins create more surface area for the heat to dissipate. In some cases, extra cooling can be achieved with the addition of a fan to create what is known as forced convection.
The ATS-PCB1055 is designed for use-cases where large amounts of heat need to be dissipated, such as in high-power semiconductor amplifiers. Its high-performance construction includes an anodized aluminum base plate and fins made from stamped steel. Its design combines efficient heat transfer and dissipation into a cost-effective package.
Typically, the aluminum base plate of the ATS-PCB1055 is attached to the device using screws. The fins are then attached to the aluminum plate with a conductive thermal paste or an insulated thermal pad. This ensures adequate contact between the aluminum base and the fins, allowing for effective heat transfer. Once the thermal-heat sink is in place, air will flow over the fins and carry away the heat generated by the device.
The ATS-PCB1055 is well-suited for use in high-power applications, such as those found in semiconductor power amplifiers. Its efficient design and construction ensure that heat is effectively dissipated from the device, preventing it from overheating. In addition, its cost-effective design and construction make it an attractive option for many applications.
The specific data is subject to PDF, and the above content is for reference