ATS-PCB1063

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	Bolt On and Board Mounts
Shape:	Rectangular, Fins
Length:	1.180" (29.97mm)
Width:	1.000" (25.40mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.00°C/W @ 200 LFM
Thermal Resistance @ Natural:	18.00°C/W
Material:	Copper
Material Finish:	Tin

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ATS-PCB1063 Thermal - Heat Sinks

The ATS-PCB1063 thermal - heat sink refers to a kind of devices that are responsible for dissipating the thermal energy of the heat-generating components. It is an important part of laptop, desktop, and other thermal control systems. The device is composed of a metal base plate that is heated by a heat source, a fan mechanism, and a metal extrusion covering. The metal extrusion covering has a several small vent ports to disperse the heat generated by the heat source, allowing it to be efficiently dissipated from the system.In order to effectively dissipate the heat generated by the heat source, the ATS-PCB1063 thermal - heat sinks use a fan mechanism to force air to flow across the surface. This airflow over the surface of the device causes a relative pressure differential between the surrounding air and the device\'s surface. The air entering the ports of the extrusion covering is warmer than the air on the opposite side, and this pressure differential creates a convective heat transfer from the device to the surrounding atmosphere.The ATS-PCB1063 thermal - heat sink works by drawing in the heat generated by the heat source and transferring it from the device to the surrounding atmosphere. The heat energy is absorbed by the fan blades and circulated inside the device. The application of fans increases the efficiency of the heat transfer to the environment by quickly dispersing the generated heat.The ATS-PCB1063 thermal - heat sink is used in a variety of applications, including desktop and laptop computers, circuit boards, control panels, and many other thermal devices. It is important to remember that this type of heat sink must be designed according to the required thermal rating and specifics of the application in order to maximize effectiveness.An important feature of the ATS-PCB1063 thermal - heat sink is that it can also be used for cooling. This is accomplished by connecting the enclosure to an air source such as an open window or a fan. The air will flow through the device, creating a cooling effect on the components inside. This can be an effective way to manage interior temperatures of electronic equipment.In addition to dissipating heat, the ATS-PCB1063 thermal - heat sink can also be used to transfer heat from one component to another. This is accomplished through the use of a thermal interface material, which is placed between the two objects and acts as a bridge to transfer heat from one to the other. This is a useful feature for components such as CPUs, GPUs, memory modules, or any other components that need to be cooled.The ATS-PCB1063 thermal - heat sink is an integral component of any device that requires thermal management. Its ability to dissipate heat to the environment and transfer it between components engages in creating efficient and reliable thermal devices.

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