| Allicdata Part #: | ATS2108-ND |
| Manufacturer Part#: |
ATS-PCB1066 |
| Price: | $ 0.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK TO-220/TO-262 W/TAB |
| More Detail: | Heat Sink TO-220, TO-262 Aluminum Board Level, Ve... |
| DataSheet: |  ATS-PCB1066 Datasheet/PDF |
| Quantity: | 1985 |
| 1 +: | $ 0.23940 |
| 10 +: | $ 0.22932 |
| 25 +: | $ 0.21773 |
| 50 +: | $ 0.21193 |
| 100 +: | $ 0.20903 |
| 250 +: | $ 0.19472 |
| 500 +: | $ 0.18325 |
| 1000 +: | $ 0.16607 |
| 5000 +: | $ 0.16035 |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220, TO-262 |
| Attachment Method: | Clip and PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 0.748" (19.00mm) |
| Width: | 0.504" (12.80mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.20°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 27.30°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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The ATS-PCB1066 is an advanced thermal solution for printed circuit board applications. It is designed for high power and temperature management systems, utilizing multiple heat sink layers, a thin dielectric coating, and an efficient thermal interface material. The ATS-PCB1066 is a robust solution for protection of sensitive components and reliable operation up to high-power transmission levels.
The ATS-PCB1066 is a two-layer thermal protection board, consisting of a top copper layer and a bottom polymer layer. The copper layer acts as a heat spreader and has an insulating dielectric coating to keep the high thermal power transfer from spreading to other components on the board. The bottom polymer layer also functions as an insulator and helps to resist the thermal gradient caused by the heat generated by the components.
The ATS-PCB1066 is designed for maximum efficiency by dissipating heat without adding additional components, such as thermal grease, to the board. The thermal grease is applied between the two layers to increase the thermal conductivity between the components and the heat sink. This increases heat transfer rates and helps to keep the components running cooler.
The ATS-PCB1066 also has a variety of features for superior thermal protection. Its dielectric coating enables high currents to be transferred without additional insulation, and its three-layer design helps to reduce temperature rise. It makes the most of the available space, and its high thermal conductivity allows it to be used with multiple power components.
The ATS-PCB1066’s efficient heat transfer and superior protection make it an excellent choice for any thermal application. It is ideal for high-end servers and other electronic equipment that require high power levels and efficient heat dissipation. It is also suitable for market segments that require reliable operation and high performance.
In conclusion, the ATS-PCB1066 is a thermal-heat sink solution for printed circuit boards, combining efficiency, performance and protection. It is suitable for a wide range of applications and is an ideal choice for any high-end thermal management system. With its advanced technology and robust design, the ATS-PCB1066 is the perfect choice for any high-power electronic equipment.
The specific data is subject to PDF, and the above content is for reference