ATS-PCB1068

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	Clip and PC Pin
Shape:	Rectangular, Fins
Length:	1.375" (34.93mm)
Width:	0.860" (21.84mm)
Diameter:	--
Height Off Base (Height of Fin):	0.358" (9.10mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	11.00°C/W @ 200 LFM
Thermal Resistance @ Natural:	16.00°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Introduction

Thermal - Heat Sinks are an important and necessary component in most electronic systems. They help dissipate and spread out the generated heat from the components within the circuit, preventing them from becoming too hot and affecting their performance. The ATS-PCB1068 is one of the most efficient and reliable types of heat sinks which is designed to improve the thermal properties of electronic systems. This article will discuss the application field and working principle of the ATS-PCB1068 heat sinks.

Application Field

The ATS-PCB1068 is suitable for a wide range of applications. One of its main uses is as a heat sink for power transistors, such as MOSFETs, IGBTs, and SBTs. It can also be used for a variety of other heat-generating components like microprocessors, video cards, microcontrollers, and other integrated chips. For applications requiring higher power dissipation, ATS-PCB1068 heat sinks are ideal due to their large surface area and efficient thermal transfer. The large number of exposed fins allows for high air flow and efficient heat dissipation, making them highly efficient for dissipating large amounts of heat.

Working Principle

The working principle of ATS-PCB1068 heat sinks is based on a common thermal transfer method known as convection. This method involves the transfer of heat from one object to another through the air. The ATS-PCB1068 heat sink is designed with a large number of exposed fins which allow air to freely flow over them and transfer heat away from the components. The heat is then absorbed by the fins and transferred to the ambient air. This creates a cooling effect which reduces the operating temperature of the components, increasing their efficiency and reliability.

Conclusion

In conclusion, ATS-PCB1068 heat sinks offer excellent thermal dissipation and efficiency due to their large surface area and efficient convection cooling. They are suitable for use in a variety of applications, such as power transistors, microprocessors, video cards, and other integrated chips. ATS-PCB1068 heat sinks are an ideal solution for applications requiring high thermal dissipation and improved reliability.

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