| Allicdata Part #: | ATS2112-ND |
| Manufacturer Part#: |
ATS-PCB1070 |
| Price: | $ 0.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK TO-220 BLACK |
| More Detail: | Heat Sink TO-220 Aluminum Board Level |
| DataSheet: |  ATS-PCB1070 Datasheet/PDF |
| Quantity: | 1709 |
| 1 +: | $ 0.21420 |
| 10 +: | $ 0.20349 |
| 25 +: | $ 0.19354 |
| 50 +: | $ 0.18837 |
| 100 +: | $ 0.18579 |
| 250 +: | $ 0.17307 |
| 500 +: | $ 0.16289 |
| 1000 +: | $ 0.14762 |
| 5000 +: | $ 0.14253 |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | TO-220 |
| Attachment Method: | Bolt On |
| Shape: | Rectangular, Fins |
| Length: | 0.750" (19.05mm) |
| Width: | 0.520" (13.21mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.375" (9.52mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.80°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 25.90°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management is an essential component of any electronic device or system that seeks to maintain a safe operating temperature. The ATS-PCB1070 is a passive heat sink designed to transfer heat away from integrated circuit (IC) and other thermally sensitive components, and a viable choice for thermal management in many situations. This article will provide an overview of the ATS-PCB1070 and its application fields, as well as its working principles and how it manages heat.
Overview
The ATS-PCB1070 is a passive heat sink made of anodized aluminum alloy, designed to transfer heat away from thermally sensitive components. Its lightweight and low-profile design make it suitable for applications where size and weight are of concern, such as laptop computers, tablets, and other handheld devices. It is also designed to be easy and quick to install, requiring no additional tools or hardware. The ATS-PCB1070 features a ribbed fin design to minimise resistance to airflow and make its thermal management more efficient. It is available in a variety of sizes, with the standard configuration measuring 15.2cmx15.2cm and weighing just 85g.
Application Fields
The ATS-PCB1070 is designed to be used in a variety of applications, such as notebook, tablet, and desktop computers; television and display screens; instrumentation control systems; audio/video equipment; and any other thermally sensitive electronic equipment. The ATS-PCB1070 is best suited to dissipate the heat generated by CPUs, GPUs, power amplifiers, and other high-powered components. It is also ideal for cooling components in high-temperature industrial and medical equipment, as well as specialty electronics.
Working Principle
The ATS-PCB1070 works by transferring heat away from sensitive components and dissipating it into the surrounding environment. This is accomplished through a process referred to as “dissipation.” Heat is dissipated in three ways. First, it is radiated away from the component and heat sink as thermal energy. Second, it is convected away from the component and heat sink as naturally occurring air currents. Third, it is conducted away from the component and heat sink through contact with other components or structures. The ATS-PCB 1070 is designed to be used in combination with an active cooling system, such as forced air, to maximize heat transfer and therefore maximize the time the component can operate in a safe temperature range.
Benefits
The ATS-PCB1070 provides a number of benefits, including the ability to transfer heat more quickly and effectively than traditional active cooling systems. This makes the device well-suited to efficiently dissipating the heat generated by high-powered components. Additionally, its light weight and low profile design make it ideal for use in weight and space-constrained applications, such as handheld devices and other portable electronic equipment. The ATS-PCB1070 is also easy to install, requiring no additional hardware or tools. Finally, its ribbed fin design reduces air resistance, which further enhances its thermal management capabilities.
Conclusion
The ATS-PCB1070 is an effective and efficient solution for thermal management, designed to transfer heat away from ICs and other thermally sensitive components. Its lightweight and low profile design make it suitable for applications such as laptops, tablets, and other handheld devices, and it is designed to be easy and quick to install. The ATS-PCB1070 also features a ribbed fin design to minimize air resistance, making it well-suited to dissipating the heat generated by high-power components. Overall, the ATS-PCB1070 is an excellent choice for thermal management in many situations.
The specific data is subject to PDF, and the above content is for reference