| Allicdata Part #: | ATS2116TR-ND |
| Manufacturer Part#: |
ATS-PCB1074 |
| Price: | $ 0.36 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK TO-263 COPPER |
| More Detail: | Heat Sink TO-263 (D²Pak) Copper Top Mount |
| DataSheet: |  ATS-PCB1074 Datasheet/PDF |
| Quantity: | 2750 |
| 250 +: | $ 0.32453 |
| 500 +: | $ 0.30542 |
| 1250 +: | $ 0.27679 |
| 6250 +: | $ 0.26725 |
| 12500 +: | $ 0.24816 |
| 25000 +: | $ 0.24339 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | TO-263 (D²Pak) |
| Attachment Method: | -- |
| Shape: | Rectangular, Fins |
| Length: | 0.500" (12.70mm) |
| Width: | 1.031" (26.20mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.401" (10.20mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 18.00°C/W |
| Material: | Copper |
| Material Finish: | Tin |
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Thermal management remains an important factor in the design of electronic systems with increasing power and signal density. Heat sinks are widely used in today’s electronics to transfer heat and dissipate it efficiently. The ATS-PCB1074 is a thermal management solution based on an aluminum extrusion that can be used in a variety of applications within the electronics industry.
The ATS-PCB1074 is a high-performance heat sink designed to dissipate and remove heat from devices mounted on printed circuit boards (PCBs). The ATS-PCB1074 is a thermally-conductive, self-supporting structure composed of an aluminum extrusion shape with ribbed design that creates a large surface area for optimal heat dissipation. Unlike fans or other active cooling methods, the ATS-PCB1074 is a passive thermal solution, requiring no operating power and no maintenance.
The ATS-PCB1074 has a degree of flexibility in its assembly and mounting options. It is available in a variety of form factors, with different sizes and configurations able to be custom-ordered to fit onto PCBs of various shapes and sizes. It can be mounted directly onto the PCB using screws or soldered, and also can be used for heat dissipation in top-down configurations when combined with an add-on heatsink.
The ATS-PCB1074 is engineered to dissipate heat more efficiently and effectively than other thermal management solutions. It is constructed of aluminum and uses an anodized finish that is resistant to oxidation and corrosion. The ribbed design and larger surface area increase the amount of surface area in contact with the air, allowing for faster heat dissipation as the air travels through the depressions and channels on the surface.
The ATS-PCB1074 uses convection to dissipate heat as hot air is drawn in through the bottom and top channels of the heat sink. The bottom channels allow air to enter the heat sink and contact the components, efficiently spreading heat into the heat sink and dissipating it. The top channels pull in the hot air and exhale it out, removing the heat from within the heat sink and the components. The ATS-PCB1074 is perfect for use in high-power devices and high-frequency components, as it allows the overheating components to remain cool even under high operating loads.
The ATS-PCB1074 is an ideal choice for applications requiring thermal management solutions. Its flexibility, efficient cooling performance, and durability make it an excellent choice for devices such as power supplies, LED lighting, and power ICs, as well as any application requiring high-performance cooling with minimal operating power.
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