ATS-TI1OP-519-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS2179-ND

Manufacturer Part#:

ATS-TI1OP-519-C1-R0

Price: $ 4.37
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK TI TAS5612 AND TAS5614
More Detail: Heat Sink
DataSheet: ATS-TI1OP-519-C1-R0 datasheetATS-TI1OP-519-C1-R0 Datasheet/PDF
Quantity: 481
1 +: $ 3.96900
10 +: $ 3.86001
25 +: $ 3.64543
50 +: $ 3.43098
100 +: $ 3.21653
250 +: $ 3.00208
500 +: $ 2.78764
1000 +: $ 2.73403
Stock 481Can Ship Immediately
$ 4.37
Specifications
Series: *
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

In the field of thermal management, heat sinks are one of the most important pieces of equipment used to dissipate heat and prevent components from overheating. The ATS-TI1OP-519-C1-R0 is a reliable, efficient, and cost-effective solution for high precision heat sinking. This product has been specifically designed to ensure maximum thermal performance with minimal impact on system performance.

Application Field and Working Principle of ATS-TI1OP-519-C1-R0

The ATS-TI1OP-519-C1-R0 is a room temperature heat sink designed to absorb and dissipate heat from electronic components and systems. This product is ideal for applications that require high precision thermal performance, such as telecommunications, medical, Automotive, renewable energy, and industrial. The heat sink is composed of premium quality aluminum alloy that is both lightweight and capable of dissipating heat quickly and effectively.

The ATS-TI1OP-519-C1-R0 is engineered with optimal thermal design principles to ensure maximum thermal efficiency and superior heat dissipation. Its integrated airflow design allows air to move freely over its fins, creating an efficient cooling solution. The heat sink is also equipped with a specialized thermal compound to provide additional thermal conductivity and protection from high temperatures. Additionally, the product is designed with a minimal amount of components and is highly resistant to corrosion.

In order to ensure proper operation, the ATS-TI1OP-519-C1-R0 should be properly mounted using the provided mounting brackets. The heat sink should be securely attached to the board and the backplate should be properly oriented to ensure sufficient heat disbursement. Additionally, the heat sink should be properly sealed to prevent dust and debris from entering and the cooling system should be properly sealed to ensure optimal airflow and to prevent air leakage.

Benefits of ATS-TI1OP-519-C1-R0

The ATS-TI1OP-519-C1-R0 is one of the most reliable and efficient heat sinks available on the market. It provides superior thermal performance with minimal impact on system performance. Additionally, the product does not require the use of expensive materials or components, making it a more cost-effective solution than other alternatives. Furthermore, the product is easy to install and requires minimal maintenance due to its durable construction.

The ATS-TI1OP-519-C1-R0 is also capable of dissipating heat effectively even in harsh environments. It has the ability to withstand extreme temperatures and pressures, making it an ideal solution for applications such as outdoor installations and ruggedized devices. Furthermore, the product is designed for easy integration and can be customized to meet the unique requirements of each application.

Conclusion

The ATS-TI1OP-519-C1-R0 is an advanced room temperature heat sink that offers superior thermal performance with minimal impact on system performance. This product is designed to be lightweight and effective in dissipating heat, making it an ideal solution for applications that require high precision thermal performance. Additionally, the product is easy to install and requires minimal maintenance. With its advanced design and durability, the ATS-TI1OP-519-C1-R0 is the perfect solution for any thermal management application.

The specific data is subject to PDF, and the above content is for reference

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