ATS-TI1OP-521-C2-R0

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Thermal management is an important element in many industrial and electronics applications, though it can be an afterthought in some designs. Heat sinks are a commonly used in thermal management, with various types of thermal solutions available for different systems. ATS-TI1OP-521-C2-R0 is a specific example of a thermal solution from Alliance Memory. This article will discuss the application field and working principle for this particular heat sink.

Application Field of ATS-TI1OP-521-C2-R0 Heat Sink

The ATS-TI1OP-521-C2-R0 is a thermal solution designed primarily for DRAM memory applications. It is suitable for use with Alliance Memory’s ATMEL® DDR3, DDR4, and Mobile DDR3 DRAM products. Its conduction-cooled design makes it ideal for highly space-constrained designs. The ATS-TI1OP-521-C2-R0 is also suitable for other electronics applications where thermal management is a concern.

Working Principle of ATS-TI1OP-521-C2-R0 Heat Sink

The ATS-TI1OP-521-C2-R0 is a conduction-cooled heat sink that operates on the basic principles of thermal management. Heat generated by the memory is conducted through the heat sink, which then dissipates it into the environment. The heat sink is designed to be mounted directly to a printed circuit board, which allows for maximum heat transfer efficiency. The heat sink features a high-efficiency base surface that promotes excellent thermal conduction. Aluminum is the base material used, which provides an attractive finish while also higher strength-to-weight ratio. It also features fins that are spaced to maximize forced-air airflow and heat dissipation.

In addition to its heat sink design, the ATS-TI1OP-521-C2-R0 also offers a range of other features that make it an ideal thermal solution. The exterior of the heat sink is coated with a black oxide finish, which prevents corrosion and provides greater durability. The heat sink also features a low-profile design to better fit into compact spaces. Finally, the sink comes with two mounting hardware options: fixed or spring-loaded.

Conclusion

Thermal solutions are an important part of many electronics applications, and the ATS-TI1OP-521-C2-R0 is a great example of a heat sink. It is designed primarily for DRAM memory applications, but is suitable for many other uses as well. Its conduction-cooled design, attractive finish, and other features make it an ideal solution for any thermal management needs.

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