| Allicdata Part #: | ATS1954-ND |
| Manufacturer Part#: |
ATS-X50325B-C1-R0 |
| Price: | $ 11.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | SUPERGRIP HEATSINK 32X32X7.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-X50325B-C1-R0 Datasheet/PDF |
| Quantity: | 100 |
| 1 +: | $ 10.71000 |
| 10 +: | $ 10.11400 |
| 25 +: | $ 9.51902 |
| 50 +: | $ 8.92409 |
| 100 +: | $ 8.32916 |
| 250 +: | $ 7.73423 |
| 500 +: | $ 7.58548 |
| Series: | maxiFLOW, superGRIP™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 1.260" (32.00mm) |
| Width: | 1.260" (32.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.295" (7.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.90°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are an integral part of the modern, sophisticated electronics industry. The use of these thermal solutions is not only necessary for efficient operation but also for maintaining the safety of components and users. The ATS-X50325B-C1-R0 is one such thermal device, designed for maximum performance and durability. Its application field and working principle are discussed below.
The ATS-X50325B-C1-R0 thermal device is a Heat Sink with advanced heat transfer technology. It is designed to take up the heat in an electronic device and dissipate it away from sensitive components and users. Its unique design and use of advanced materials make it highly efficient. The heat sink has an impedance of 25 ohms, which means that the thermal energy content in the device is absorbed effectively and released slowly. This ensures that the heat is not concentrated on any single electronic component and does not cause overheating.
The ATS-X50325B-C1-R0 is mainly used in power amplifiers, computer systems and audio devices. Its high performance ensures that heat is dissipated quickly and effectively, protecting the components from over-heating and reducing power consumption. It also provides improved sound and video quality by eliminating acoustic distortion. Furthermore, its slim and light design ensures that the device does not occupy valuable space in the user\'s home or office.
The working principle of the ATS-X50325B-C1-R0 is based on the science of thermal conduction. Thermal conduction is the process of transferring heat energy from one place to another through a substance. In this case, the thermal energy is absorbed by the Heat Sink and dissipated through the fins of the device. This ensures that the heat in the device is dissipated rapidly and effectively without overheating the components.
The ATS-X50325B-C1-R0 is a tried and trusted heat sink solution. Its advanced design and use of advanced materials ensure that it is highly effective and reliable. Its slim and lightweight design also make it suitable for use in any space-restricted area. With the ATS-X50325B-C1-R0, your electronics equipment will be more efficient and safer than ever before.
The specific data is subject to PDF, and the above content is for reference