| Allicdata Part #: | ATS1975-ND |
| Manufacturer Part#: |
ATS-X50400G-C1-R0 |
| Price: | $ 13.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | SUPERGRIP HEATSINK 40X40X12.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-X50400G-C1-R0 Datasheet/PDF |
| Quantity: | 53 |
| 1 +: | $ 11.95740 |
| 10 +: | $ 11.29270 |
| 25 +: | $ 10.62890 |
| 50 +: | $ 9.96443 |
| 100 +: | $ 9.30020 |
| 250 +: | $ 8.63583 |
| 500 +: | $ 8.46979 |
| Series: | maxiFLOW, superGRIP™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.492" (12.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.60°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important factor in the operation and safety of any electrical system. Given the large amount of heat generated by the components of an electronic system, an effective thermal management solution is a necessity. The ATS-X50400G-C1-R0 thermal-heat sink from Amphenol Advanced Sensors is designed to provide reliable thermal management in challenging applications. With its features, this thermal-heat sink can effectively dissipate heat without significantly reducing the system\'s efficiency.
The ATS-X50400G-C1-R0 features a combination of copper and aluminum layers to provide an effective thermal system. To ensure efficient heat dissipation, the thermal-heat sink operates at temperatures between -40°C and +100°C. The copper/aluminum combination also provides a high degree of thermal conductivity. Additionally, the thermal-heat sink features a one-piece design for minimal assembly time and heat bleeding.
The ATS-X50400G-C1-R0 is designed to provide a few key benefits. Firstly, its one-piece construction with heat-sealed corners provides the highest level of stability. Secondly, it features a recessed base with a low profile to minimize thermal resistance. This, coupled with the heat-sealed corners, allows the thermal-heat sink to effectively dissipate heat from the system without significantly increasing the system\'s power consumption.
The ATS-X50400G-C1-R0 thermal-heat sink is designed to work with a wide range of electronic systems in various applications. The combination of copper and aluminum layers provides the user with a highly efficient solution for cooling any power system. Moreover, due to its construction materials and one-piece design, the thermal-heat sink is a reliable and cost-effective thermal-management tool.
In addition to providing efficient cooling for power systems, the ATS-X50400G-C1-R0 can also be used in many other applications. Some of these applications include automotive, telecommunications, industrial, medical, and aerospace systems. As a result, the ATS-X50400G-C1-R0 is a versatile and reliable thermal management solution for any application.
The ATS-X50400G-C1-R0 thermal-heat sink is a reliable solution to ensure efficient heat dissipation in any electronic system. The combination of copper and aluminum layers provide excellent thermal conductivity. In addition, the one-piece design and recessed base with a low profile help reduce the thermal resistance. As a result, the ATS-X50400G-C1-R0 can help improve the performance of any system and provide reliable and cost-effective thermal management.
The specific data is subject to PDF, and the above content is for reference