ATS-X50425P-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1993-ND

Manufacturer Part#:

ATS-X50425P-C1-R0

Price: $ 14.43
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: SUPERGRIP HEATSINK 42X42X17.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-X50425P-C1-R0 datasheetATS-X50425P-C1-R0 Datasheet/PDF
Quantity: 215
1 +: $ 13.11660
10 +: $ 12.38580
25 +: $ 11.65700
50 +: $ 10.92850
100 +: $ 10.19990
250 +: $ 9.47128
500 +: $ 9.28914
Stock 215Can Ship Immediately
$ 14.43
Specifications
Series: maxiFLOW, superGRIP™
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip, Thermal Material
Shape: Square, Angled Fins
Length: 1.654" (42.00mm)
Width: 1.654" (42.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.689" (17.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

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The ATS-X50425P-C1-R0 thermal solution is specially designed to meet the cooling requirements for today’s extreme high-power applications. This versatile heat sink is suitable for a wide variety of applications, including telecommunications, computer, automotive, and consumer electronics. The ATS-X50425P-C1-R0 heat sink is perfect for applications that require reliable, high-efficiency thermal solutions.

The primary function of a heat sink is to absorb, transfer, and dissipate heat from an object or device into the air or liquid. The ATS-X50425P-C1-R0 heat sink is designed to do this in a more efficient manner, with improved heat transfer properties. The heat sink is constructed of a combination of metal fins and aluminum plates that form a single, uniform structure. This structure facilitates the rapid movement of heat away from the heat source to ensure that temperatures in the system remain low.

The ATS-X50425P-C1-R0 heat sink consists of a layered system of fins that are designed to maximize heat transfer efficiency. The fins are formed in a staggered pattern to maximize surface area. This staggered pattern allows for improved airflow and increased thermal efficiency. The fins are also designed for maximum contact pressure between the air and the heat source, ensuring maximum heat transfer.

The ATS-X50425P-C1-R0 thermal solution is further enhanced with the addition of a heat spreader plate. This small plate is attached to the fin assembly and helps to disperse heat more evenly across the heat sink\'s fins. This helps to reduce thermal hotspots and ensures that temperatures in the system remain low. Additionally, the heat spreader plate helps to reduce air turbulence, which further enhances the heat sink\'s performance.

The ATS-X50425P-C1-R0 thermal solution also features advanced thermal management technologies. This includes optimized fan placement, advanced airflow designs, and embedded thermal sensors. These technologies help ensure that temperatures remain low and that the heat sink operates efficiently. Additionally, the fan placement is designed to ensure that the fan is the last line of defense against heat buildup.

The ATS-X50425P-C1-R0 thermal solution is designed to satisfy the needs of today\'s extreme high-power applications. The heat sink offers efficient heat transfer, reliable cooling, and advanced thermal management technologies. It is perfect for applications that require high-efficiency thermal solutions.

The specific data is subject to PDF, and the above content is for reference

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