| Allicdata Part #: | ATS1960-ND |
| Manufacturer Part#: |
ATS-X50450B-C1-R0 |
| Price: | $ 12.38 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | SUPERGRIP HEATSINK 45X45X7.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-X50450B-C1-R0 Datasheet/PDF |
| Quantity: | 89 |
| 1 +: | $ 11.25810 |
| 10 +: | $ 10.63310 |
| 25 +: | $ 10.00770 |
| 50 +: | $ 9.38224 |
| 100 +: | $ 8.75672 |
| 250 +: | $ 8.13127 |
| 500 +: | $ 7.97489 |
| Series: | maxiFLOW, superGRIP™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.295" (7.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-X50450B-C1-R0 thermal-heat-sink is designed for a particular application field, as well as a specific use case. Utilizing passive cooling technology, the thermal-heat-sink plays a crucial role in dissipating heat away from sensitive electronic components. By conducting heat away from these components, the ATS-X50450B-C1-R0 helps to protect vital electronics from damage.
The ATS-X50450B-C1-R0 thermal-heat-sink is composed of an aluminum dissipater fin and a former. The aluminum fin covers the key components of a system, such as processors and memory chips. The fin is arrayed with densely packed fins to maximize the surface area exposed to the cooling air. Heat is then conducted through the fin away from the components. The fin is then in turn conductive to the former. In some cases an additional heat spreaders are incorporated as an additional layer of insulation between the component and the fin.
The former, typically composed of a metal such as aluminum, is designed to hold the fin securely in place as well as improve the thermal characteristics of the assembly. This is achieved by the former aiding in the efficient transfer of the heat from the fins to the environment. The ATS-X50450B-C1-R0 former is specially shaped to improve the effectiveness of heat transfer.
The great benefit of the ATS-X50450B-C1-R0 is that it is extremely lightweight, safe and relatively inexpensive. In addition, heat sinks are very easy to install and maintain, requiring no power source. Heat-sinks are also capable of dissipating heat from multiple heat sources, allowing for better temperature control.
When applying the ATS-X50450B-C1-R0 in a system, the thermal-heat-sink must be properly mounted and sealed. This will ensure that the thermal performance of the system is maintained. In addition, proper air flow must be ensured to reduce the ambient temperature inside the enclosure. Even though the thermal-heat-sink will help to reduce the temperature, other components such as fans and air ducts may also need to be employed to maintain the desired temperature.
The thermal-heat-sink will also need to be re-checked at regular intervals to ensure that the fins are properly alligned and free of any obstructions. If a blockage is present, the fin must be adjusted accordingly. If it is not, it can lead to increased temperatures.
The ATS-X50450B-C1-R0 thermal-heat-sink is an ideal solution for a wide range of application fields. From high power PCBs to high-end electronic devices, the thermal-heat-sink helps to dissipate heat efficiently while maintaining a safe operating temperature. In addition, the thermal-heat-sink is highly affordably priced, making it a great choice for many applications that need to reduce costs.
The specific data is subject to PDF, and the above content is for reference