ATS-X50450P-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1994-ND

Manufacturer Part#:

ATS-X50450P-C1-R0

Price: $ 14.71
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: SUPERGRIP HEATSINK 45X45X17.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-X50450P-C1-R0 datasheetATS-X50450P-C1-R0 Datasheet/PDF
Quantity: 18
1 +: $ 13.36860
10 +: $ 12.62840
25 +: $ 11.88560
50 +: $ 11.14270
100 +: $ 10.39980
250 +: $ 9.65699
500 +: $ 9.47128
Stock 18Can Ship Immediately
$ 14.71
Specifications
Series: maxiFLOW, superGRIP™
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip, Thermal Material
Shape: Square, Angled Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.689" (17.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 1.60°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

.

The ATS-X50450P-C1-R0 is a thermal - heat sink solution by Alpha & Omega Semiconductor (AOS). This product is designed to provide an efficient and reliable cooling solution for different operating environments. It features a robust design that can handle a wide range of thermal requirements and provide superior heat dissipation results.

The ATS-X50450P-C1-R0 utilizes an aluminum dielectric material in the base to help distribute heat effectively and provide maximum protection from shock and vibration. The heat sink also includes a built-in fan which further aids in efficient cooling. The fan is adjustable to optimize for different mounting positions. Additionally, the ATS-X50450P-C1-R0 is also fitted with flexible mounting holes for easy installation in the chassis.

The ATS-X50450P-C1-R0 is an ideal solution for applications such as telecommunications systems, automotive electronic systems, industrial computers, embedded systems, and military applications. The device is capable of dissipating up to 150 watts of heat, making it suitable for different industrial and automotive applications. It is also designed with an adjustable temperature control to regulate the flow of air and achieve optimum cooling.

The working principle of the ATS-X50450P-C1-R0 is based on the principles of convective heat dissipation. As heat is generated from an electronic component, the fan draws air from the environment and drives it past the heat generating component. The air is then ejected out of the chassis, taking the heat with it. The aluminum dielectric material in the base provides an effective heat transfer path for the heat and allows efficient heat dissipation. Heat is also dissipated across the surface of the device, cooling down the component.

The ATS-X50450P-C1-R0 is a versatile and reliable thermal solution for a variety of applications. Its robust design and adjustable fan speed make it an ideal choice for applications requiring a reliable and efficient cooling solution. Its aluminum dielectric material provides effective heat transfer and heat dissipation, while its adjustable temperature control makes it suitable for different operating environments. With the features provided, the ATS-X50450P-C1-R0 is an excellent thermal - heat sink solution for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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