ATS-X53210G-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS2013-ND

Manufacturer Part#:

ATS-X53210G-C1-R0

Price: $ 11.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: SUPERGRIP HEATSINK 21X21X12.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-X53210G-C1-R0 datasheetATS-X53210G-C1-R0 Datasheet/PDF
Quantity: 82
1 +: $ 10.40760
10 +: $ 9.83178
25 +: $ 9.25344
50 +: $ 8.67510
100 +: $ 8.09676
250 +: $ 7.51842
500 +: $ 7.37380
Stock 82Can Ship Immediately
$ 11.45
Specifications
Series: superGRIP™
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip, Thermal Material
Shape: Square, Fins
Length: 0.827" (21.00mm)
Width: 0.827" (21.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.492" (12.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.10°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

"Thermal - Heat Sinks" are used in many industrial and commercial applications to protect components and systems from overheating and thermal damage. In order to ensure that theses systems remain functioning properly, the efficiency of the heat sink must be kept at a high level. The ATS-X53210G-C1-R0 is one of the leading models of heat sinks that is available on the market today. This heat sink offers superior performance and protection against extreme thermal and environmental conditions.

The ATS-X53210G-C1-R0 is a gravity-type heat sink with an outer aluminum fin design that is designed to provide excellent air flow characteristics for the efficient transfer and dispersion of heat. The fins are designed to provide an extra measure of protection against heat radiation, further optimizing thermal efficiency. The base of the heat sink is made of milled aluminum, providing for even more superior thermal conductivity.

The ATS-X53210G-C1-R0 has a remarkable heat dissipation rate of 28W per gram, allowing it to quickly and effectively dissipate heat from the application and provide complete protection from temperature-related damage. The fins on the heat sink are arranged perpendicular to the airflow in order to maximize cooling performance. The airflow velocity is also increased by the patented fin design. In addition, the heat sink is compatible with most popular fan types, making it fit for a variety of different applications.

The ATS-X53210G-C1-R0 heat sink is well suited for many types of applications, including computers, servers, telecommunication equipment, power supplies, automotive electronics, automotive air conditioners, UPS, and home and industrial air conditioners. Its efficient and effective heat dissipation capabilities make it suitable for applications where long-term reliability and extended life are important. Additionally, the heat sink can be used in conditions where temperature variation can be significant, such as in outdoor applications.

The working principle of the ATS-X53210G-C1-R0 is quite straightforward: heat generated by the application is absorbed and dissipated by the heat sink through expelling the heat away from the component or system. This process works by forcing heated air away from the heat sink and out of the component or system through the fins. This eliminates the risk of thermal damage caused by extremely high temperatures.

The ATS-X53210G-C1-R0 is designed to operate in both active and passive cooling configurations. In active cooling configurations, the heat sink is used in conjunction with a fan and controller to ensure that optimal performance is achieved. The fan will pull air through the fins, which will help dissipate the heat from the component or system. Meanwhile, the controller will keep the fan running only at the required speeds to ensure efficient cooling.

In passive cooling configurations, the ATS-X53210G-C1-R0 is used without a fan or controller to achieve efficient cooling. In this configuration, the heat sink is directly exposed to the ambient air, allowing the natural convection process to pull the heated air away from the component or system. This efficient cooling process eliminates the need for additional power or noise disruption caused by fans and controllers.

Overall, the ATS-X53210G-C1-R0 is one of the best thermal solutions available on the market today. Its efficient and reliable design allows for an extended life in a variety of different applications. The fins on the heat sink are designed to optimize the cooling process and the milled aluminum base provides superior thermal conductivity. The ATS-X53210G-C1-R0 is compatible with both active and passive cooling configurations and provides an effective and powerful means of protecting components and systems from damage caused by extreme temperatures.

The specific data is subject to PDF, and the above content is for reference

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