Allicdata Part #: | ATS2014-ND |
Manufacturer Part#: |
ATS-X53230G-C1-R0 |
Price: | $ 11.45 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | SUPERGRIP HEATSINK 23X23X12.5MM |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ATS-X53230G-C1-R0 Datasheet/PDF |
Quantity: | 343 |
1 +: | $ 10.41390 |
10 +: | $ 9.83304 |
25 +: | $ 9.25442 |
50 +: | $ 8.67601 |
100 +: | $ 8.09760 |
250 +: | $ 7.51919 |
500 +: | $ 7.37450 |
Series: | superGRIP™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Clip, Thermal Material |
Shape: | Square, Fins |
Length: | 0.900" (23.00mm) |
Width: | 0.906" (23.01mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.492" (12.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 8.80°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal solution has always been an important part of industrial control and communications systems. Heat sinks are an effective way to dissipate heat from one type of circuit to another. The ATS-X53230G-C1-R0 is a heat sink designed for cooling high end performance processors, controllers, and RF devices in an industrial or commercial environment.
The ATS-X53230G-C1-R0 is a thermal-to-air heat sink with an aluminum enclosure shrouding a finned aluminum core. This core is designed to efficiently transfer heat from the processor or device to the ambient air and lower the temperature of the component. The enclosure is made from corrosion resistant and light weight aluminum, and has built in fins that aid in heat dissipation. The fins are arranged in a triangular pattern and are spaced evenly around the core to maximize the surface area, allowing heat to spread over a larger area.
With an LED indicator light, the ATS-X53230G-C1-R0 is designed to warn of heat overloads in the system. The LED is wired directly to the processor and will light up if the processor temperature rises too high. This ensures safety and protection for the system and component. The ATS-X53230G-C1-R0 also features an integrated thermal protection function. This function monitors the temperature of the processor or component and will shut it down if the temperature rises beyond the safe operating level.
The ATS-X53230G-C1-R0 is designed specifically for cooling processors, controllers, and RF devices in an industrial or commercial environment. The ATS-X53230G-C1-R0 is designed with a unique combination of anodized aluminum heat sinks and radial fans. This combination allows for a large surface area to dissipate heat faster. The design is also self- defeating in that as the temperature rises, the fans spin faster to keep the processor and component cool.
The ATS-X53230G-C1-R0 heat sink is designed to be durable and reliable in high-temperature, high-performance industrial and commercial environments. The aluminum casing is corrosion-resistant and designed to stand up to extreme temperatures and toxic environments. The radial fans are also rated for up to 80,000 hours of continuous use, and the thermal protection feature ensures the safety of the processor and device under all conditions.
In conclusion, the ATS-X53230G-C1-R0 is a thermal-to-air heat sink designed to keep high end processors, controllers, and RF devices cool in an industrial or commercial environment. With its unique anodized aluminum heat sinks and radial fans, the ATS-X53230G-C1-R0 is designed to dissipate heat quickly and efficiently, while the integrated thermal protection ensures the safety of the processor and device. The ATS-X53230G-C1-R0 is reliable and durable, and can stand up to extreme temperatures and toxic environments.
The specific data is subject to PDF, and the above content is for reference