| Allicdata Part #: | ATS2030-ND |
| Manufacturer Part#: |
ATS-X53230P-C1-R0 |
| Price: | $ 12.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | SUPERGRIP HEATSINK 23X23X17.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-X53230P-C1-R0 Datasheet/PDF |
| Quantity: | 26 |
| 1 +: | $ 11.41560 |
| 10 +: | $ 10.78240 |
| 25 +: | $ 10.14800 |
| 50 +: | $ 9.51377 |
| 100 +: | $ 8.87950 |
| 250 +: | $ 8.24516 |
| 500 +: | $ 8.08661 |
| Series: | superGRIP™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 0.900" (23.00mm) |
| Width: | 0.906" (23.01mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.689" (17.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-X53230P-C1-R0 is a device that is used for a variety of applications related to thermal management. This device is a thermal-heat sink, which is designed to passively cool components in order to reduce the amount of heat generated. This heat sink works by absorbing the heat from the components and then transferring it to the ambient atmosphere using convection.
This device is most commonly used in electronic systems that generate a lot of heat. This includes computers, gaming consoles, and home theater systems. The heat sink allows these components to stay cool, preventing any damage that could be caused by excess heat. This allows the components to last longer and perform better.
The ATS-X53230P-C1-R0 has a unique design that is specifically made to be as effective as possible. The heat sink consists of a series of aluminum fins that are attached to a baseplate. This baseplate is made of copper and is designed to quickly transfer the heat away from the components. The aluminum fins help to increase the surface area, which allows it to dissipate more heat. This also increases the amount of air flow that can be drawn away from the components.
The ATS-X53230P-C1-R0 is a great choice for anyone looking to keep their components cool. The aluminum fins and copper baseplate help increase the efficiency of the device, allowing it to dissipate more heat than other heat sinks. Additionally, the design is optimized for air flow, which helps ensure that the components are kept cool.
This device can also be used in combination with other cooling methods in order to further increase its cooling performance. This includes the use of fans or other devices to actively draw away the heat generated. This can help make sure that the components stay at an acceptable temperature, allowing them to operate at peak performance.
Overall, the ATS-X53230P-C1-R0 is a great choice for anyone looking to keep their components cool. With its optimized design and ability to work in combination with other cooling methods, it can provide reliable cooling for a variety of electronic systems. Therefore, it is a great choice for anyone who needs to keep their components running at peak performance.
The specific data is subject to PDF, and the above content is for reference