| Allicdata Part #: | ATS2015-ND |
| Manufacturer Part#: |
ATS-X53250G-C1-R0 |
| Price: | $ 11.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | SUPERGRIP HEATSINK 25X25X12.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-X53250G-C1-R0 Datasheet/PDF |
| Quantity: | 80 |
| 1 +: | $ 10.61550 |
| 10 +: | $ 10.02830 |
| 25 +: | $ 9.43838 |
| 50 +: | $ 8.84863 |
| 100 +: | $ 8.25867 |
| 250 +: | $ 7.66878 |
| 500 +: | $ 7.52129 |
| Series: | superGRIP™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.492" (12.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-X53250G-C1-R0 heat sink is designed to meet the needs of specific thermal management applications. The design is modular, allowing the user to mix and match different base, sink and thermal packages for individual solutions based on the space and air flow requirements for each application.
Application Fields of ATS-X53250G-C1-R0
The ATS-X53250G-C1-R0 is capable of managing all heat sinks for consumer grade electronics, such as network switches, routers, TV boxes, gaming consoles, media players, and more. It can also be used in industrial or automotive applications where a reliable thermal solution is needed. It is also suitable for cooling components with high power densities, such as CPUs, GPUs and ASICs. As its design is modular, it can provide an efficient solution for nearly any kind of application.
Working Principle
The ATS-X53250G-C1-R0 is designed to actively manage the heat dissipation through dynamic air management. The heat sink cooling unit consists of two main components - a base and a sink. The base contains the thermal elements which are connected to the heat generating components. The sink consists of a heat exchanger layer, which helps transfer heat away from the base, and provides a cold plate when air flow is restricted. A fan is then used to provide the necessary air flow for cooling.
Through dynamic air management, the ATS-X53250G-C1-R0 is capable of controlling the intake and exhaust of air to maintain the optimal temperature for the application. With the use of sensors, the heat sink is able to adjust the fan speed to ensure that the components stay cool and at their peak performance. With its high cooling efficiency and intelligent air management features, the ATS-X53250G-C1-R0 heat sink is able to provide a reliable cooling solution for nearly any application.
Conclusion
In conclusion, the ATS-X53250G-C1-R0 heat sink offers a reliable and efficient cooling solution for a wide range of applications. Its modular design allows for an individual solution that meets space and airflow requirements for each specific application. With its dynamic air management and temperature control features, the ATS-X53250G-C1-R0 is sure to offer a reliable and effective cooling solution for your thermal management needs.
The specific data is subject to PDF, and the above content is for reference