| Allicdata Part #: | ATS2016-ND |
| Manufacturer Part#: |
ATS-X53270G-C1-R0 |
| Price: | $ 11.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | SUPERGRIP HEATSINK 27X27X12.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-X53270G-C1-R0 Datasheet/PDF |
| Quantity: | 19 |
| 1 +: | $ 10.73520 |
| 10 +: | $ 10.13800 |
| 25 +: | $ 9.54121 |
| 50 +: | $ 8.94502 |
| 100 +: | $ 8.34862 |
| 250 +: | $ 7.75236 |
| 500 +: | $ 7.60319 |
| Series: | superGRIP™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.063" (27.00mm) |
| Width: | 1.063" (27.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.492" (12.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.60°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are one of the most effective methods to remove heat from electrical and electronic components. The ATS-X53270G-C1-R0 is a high-performance heat sink that is specifically designed to increase the reliability and stability of components. This product uses a combination of heat spreading, cooling fins and air currents to dissipate thermal energy in the most efficient manner possible.
Application Field of ATS-X53270G-C1-R0
The ATS-X53270G-C1-R0 is a comprehensive solution designed for many types of industrial applications. It is suitable for use in the automotive, telecommunication, computer and consumer electronics industries. This product is also compatible to use in high temperature applications such as cooling condensers and displays.
The ATS-X53270G-C1-R0 is a low weight and low cost solution that is made of aluminum, which is known for its good thermal conductivity and durability. The heat sink is also available in a variety of sizes to meet your specific application needs.
The ATS-X53270G-C1-R0 is designed to provide an efficient thermal dissipation solution for components used in high temperature and harsh environments. This product is designed to be used in extreme conditions such as those encountered in the automotive, electrical and computer industries.
Working Principle of ATS-X53270G-C1-R0
The ATS-X53270G-C1-R0 dissipates thermal energy in three main ways: through heat spreading, cooling fins and air currents. The heat spreading method involves the diffusion of heat from a component to the entire surface of the heat sink, which results in optimal thermal dissipation. Cooling fins are used to help dissipate heat from the center of the heat sink where the most heat is concentrated.
The air currents generated by the heat sink are used to generate a thermal gradient which helps to provide longer life to the electronic components. The air currents also help to spread the heat over a larger area, allowing for more efficient heat dissipation.
The ATS-X53270G-C1-R0 is designed for applications that require high thermal performance. The product is also designed for use in harsh environments which require thermally controlled components such as in the automotive, telecommunications and computer industries. This product can be used in any type of application that requires a reliable and cost-effective way to dissipate thermal energy.
The specific data is subject to PDF, and the above content is for reference