| Allicdata Part #: | ATS2001-ND |
| Manufacturer Part#: |
ATS-X53290B-C1-R0 |
| Price: | $ 10.90 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | SUPERGRIP HEATSINK 29X29X7.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-X53290B-C1-R0 Datasheet/PDF |
| Quantity: | 100 |
| 1 +: | $ 9.90990 |
| 10 +: | $ 9.35676 |
| 25 +: | $ 8.80642 |
| 50 +: | $ 8.25601 |
| 100 +: | $ 7.70560 |
| 250 +: | $ 7.15519 |
| 500 +: | $ 7.01757 |
| Series: | superGRIP™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.142" (29.00mm) |
| Width: | 1.142" (29.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.295" (7.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks have become increasingly popular in the application fields of computing, entertainment, multimedia, and electronics. The ATS-X53290B-C1-R0 is a flagship product of the thermal management product range from Alpha Thermal and is used to heat inlet and outlet temperatures for heat exchange in order to maintain optimum system efficiency. It can also be used to dissipate the generated heat in both cooling and thermal management applications.
The impressive thermal performance of the ATS-X53290B-C1-R0 is achieved by the combined effect of its precise engineering design and excellent material composition. It features superior heat transfer capabilities along with its compatibility with all popular types of thermal grease for a variety of thermal solutions. The rigid and beautiful aluminum construction enhances the reliability and durability of the thermal solution.
The ATS-X53290B-C1-R0 actively works to disperse heat away from the device or system. The heat sink is designed to maximize the efficiency of the heat exchange process. The use of a compatible thermal grease is mandated to ensure maximum thermal protection and performance. The heat sink is designed to be both durable and lightweight and is much more efficient than traditional cooling systems. The design also allows for increased cooling capabilities and airflow thanks to the extra number of heat sink fins.
The working principle of the heat sink shares similarities with that of a cooling fan. A thermal interface medium is used to bridge the air gap between the heat sink and the device. The thermal interface medium serves as both a thermal conductor and a protective layer to reduce potential damage caused by the direct contact of the heat sink with the device. The temperature of the device is then actively cooled by the heat dispersal of the heat sink.
The ATS-X53290B-C1-R0 is perfect for a variety of applications as the heat sink is made up of thermal fins that provide higher heat dissipation profiles. This is then further enhanced by the superior performance of the thermal interface mediums as well as the lightweight and durable construction. The heat sink is ideal for applications involving CPUs, GPUs, DRAMS, and other components that require active cooling.
The ATS-X53290B-C1-R0 is an ideal thermal management solution for its industry. It has been used in a variety of computing, entertainment, multimedia, and electronic applications. With its outstanding thermal performance and superior material composition, it is no wonder why the ATS-X53290B-C1-R0 is the choice of professionals when it comes to dealing with extreme heat dispersion requirements. It is an ideal heat sink to consider when looking for an optimal thermal mitigation solution.
The specific data is subject to PDF, and the above content is for reference