| Allicdata Part #: | ATS2033-ND |
| Manufacturer Part#: |
ATS-X53290P-C1-R0 |
| Price: | $ 12.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | SUPERGRIP HEATSINK 29X29X17.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-X53290P-C1-R0 Datasheet/PDF |
| Quantity: | 62 |
| 1 +: | $ 11.76210 |
| 10 +: | $ 11.11010 |
| 25 +: | $ 10.45650 |
| 50 +: | $ 9.80294 |
| 100 +: | $ 9.14935 |
| 250 +: | $ 8.49583 |
| 500 +: | $ 8.33245 |
| Series: | superGRIP™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.142" (29.00mm) |
| Width: | 1.142" (29.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.689" (17.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-X53290P-C1-R0 is a thermal heat sink designed to aid in the cooling of electronic components. As modern electronics become smaller and more powerful, the need for a reliable cooling solution has become increasingly important. The ATS-X53290P-C1-R0 heat sink utilizes a passive-cooling approach to provide heat dissipation.
This advanced heat sink has a compact design that capable of providing a high power density. It features an aluminum construction which provides superior efficiency and reliable performance. It is also designed with a unique modular construction that allows for easy installation and maintenance.
The ATS-X53290P-C1-R0 heat sink is equipped with a variety of features that make it suitable for a range of applications. It has a continuous airflow design which ensures efficient cooling. Additionally, it features an adjustable fan speed controller which can be adjusted to meet the specific cooling requirements of different components. The heat sink also has a unique cut-out feature which allows it to be easily mounted onto a variety of electronic components.
The ATS-X53290P-C1-R0 heat sink works by dissipating heat away from delicate electronic components. The heat is dissipated into the surrounding environment via convective cooling. This process is achieved by circulating air at a high velocity across the heat sink. The air is then vented out of the system, taking the built-up heat with it. This allows the component to remain cool and functioning properly.
The ATS-X53290P-C1-R0 is an ideal solution for a variety of applications such as PCs, servers, and communications systems. It is a reliable and efficient way to keep components cool while using minimal space. The unique modular construction also makes it easy to install and maintain, making it an ideal cooling solution for a wide range of applications.
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