| Allicdata Part #: | ATS2041-ND |
| Manufacturer Part#: |
ATS-X53425P-C1-R0 |
| Price: | $ 13.73 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | SUPERGRIP HEATSINK 42X42X17.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-X53425P-C1-R0 Datasheet/PDF |
| Quantity: | 310 |
| 1 +: | $ 12.48660 |
| 10 +: | $ 11.79050 |
| 25 +: | $ 11.09710 |
| 50 +: | $ 10.40350 |
| 100 +: | $ 9.70991 |
| 250 +: | $ 9.01635 |
| 500 +: | $ 8.84296 |
| Series: | superGRIP™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.654" (42.00mm) |
| Width: | 1.654" (42.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.689" (17.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important part of any system. Heat dissipation systems, commonly known as heat sinks, are devices that contain and control the heat generated by electrical and electronic components such as processors, power supplies and motors. ATS-X53425P-C1-R0 is a thermal management solution designed to efficiently move heat away from critical components to ensure optimal performance and long life of the system.
The ATS-X53425P-C1-R0 consists of a thin finned heatsink that is made from aluminium alloy. The heatsink is designed to efficiently transfer heat away from sensitive components by dissipating the heat to the surrounding environment. The finned heatsink also comes with an optional fan to provide extra airflow and additional cooling. The aluminium alloy finned heatsink is connected to the components to be cooled via a clip or screw mount.
The ATS-X53425P-C1-R0 has a wide range of applications. It can be used to cool processors, power supplies, motors, memory modules and other components. It is also suitable for use in industrial and commercial applications. The heatsink can dissipate heat from components up to 120W.
The ATS-X53425P-C1-R0 is a passive cooling solution; it does not require any external power source to operate. The heatsink uses natural convection to dissipate heat away from components. The fins on the heatsink create turbulence that pulls air from outside of the enclosure to the heatsink; the air absorbs the heat from the components and rises up through the fins, taking the heat away from the components. The fan can be used to increase the airflow, allowing for more efficient cooling.
The ATS-X53425P-C1-R0 has a low profile design which allows for tight spaces and easy installation. It is also lightweight and durable, making it suitable for a wide range of applications. The ATS-X53425P-C1-R0 is ideal for use in environments where space is limited and cooling is critical.
The ATS-X53425P-C1-R0 is a reliable and efficient thermal heat solution that can be used in a variety of applications. It is designed to move heat away from components, ensuring their optimal performance and longevity. With its low profile design, the ATS-X53425P-C1-R0 is an ideal solution for applications where space is limited. The fan option allows for additional airflow which can help increase cooling efficiency.
The specific data is subject to PDF, and the above content is for reference