AXF382700

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Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board Integration) can provide contiguity between two PCB boards for efficient data transfer and power supply. AXF382700 is amongst such connectors, typically used for connecting FPGA-based design boards, and is a product of Amphenol Corporation. This connector serves an essential function in today’s world, especially when it comes to product constructing on a budget and maintaining efficiency in the development of time-sensitive designs.

The AXF382700 is an Array Edge Type Mezzanine (Board to Board) Connector with high-performance acousto-optic transmitters/receivers integrated. It features a high-quality black body support with a maximum pitch of 0.8mm on both sides. There are two numbers of 34-circuit in each side, with a connector width of 13mm, a length of 27mm, and a height of 8.2mm.

The connector has an extensive application field in the development of consumer electronics like cell phones, refrigerators, and multiregs. They are used as signal connector in IC, active, and passives with their ability to transmit power, current, and data. It is even heat resistant and compatible with several board spaces.

In terms of working principle, AXF382700 uses optical receivers to transmit and receive data through two paths simultaneously. It includes an LED transmitter and head-on photodiode that use this process to ensure high-speed and effective signal transmission.

The connector consists of a series of conductive paths made of gold and a dual molded contact retention. The optical devices and optical transmission lines are placed in a pattern along the connector edges. A number of photo receivers alongside an LED Transmitter is also included in the form of a hybrid integrated circuit (HIC). The hybrid integrated circuit (HIC) initiates the communication with the previously installed electrical components, which results in a data transmission interruption and impedes the process from moving further.

Apart from design flexibility and high reliability, AXF382700 also features superior signal integrity and high transmission speeds. The integrated modular design offers superior reliability for long-term performance which makes it the preferred choice for most FPGA-based designs. It also supports high frequency use, and features an effective ground shielding to reduce EMI (electromagnetic interference).

AXF382700 has a wide range of applications from the development of consumer electronics to computing, medical, automotive, aerospace, industrial, and radio-frequency applications. It is a reliable, cost-effective, and highly efficient connector that can quickly respond to signals and support a wide range of functions. It can also be used to connect FPGA-based designs quickly and efficiently, offering significant performance and scalability.

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