AXN426530P

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The AXN426530P connector is a high-density mezzanine connector designed for use on PCBs in a variety of applications, including networking, routers, servers, storage devices, and other computing systems.

The connector has two rows of 30 contacts and is an interconnecting device that allows for a robust connection between two components. The contacts have a gold plating with either a tin-lead or tin-only finish and are spaced in an array, which allows signals to be routed without interference from surrounding conductors. The contacts within the array have a different pitch to enable dense interconnection between components.

The connector is designed to meet an industry standard called mTSO/mPCA-2, which provides an array of 30 contacts in a 0.025-inch-pitch configuration that can be used for high-speed signal transfer, as well as power transfer and ground connections. The connector also has a snap-in frame that helps to reduce the time and effort required to install the connector and make a secure connection.

When looking at the application field and working principle of the AXN426530P connector, two main things can be noted. Firstly, the connector is designed for use in a variety of applications, including networking, routers, servers, storage devices, and other computing systems. In these applications, the connector will be used for transmitting signals between components in a secure and reliable way. The connector also provides additional electrical and mechanical protection for the components, which helps ensure the long-term performance of the system.

In terms of its working principle, the AXN426530P connector\'s interconnect components take advantage of the individual contacts and make a connection between them when inserted into each other. The contacts are arranged in an array and have a different pitch to ensure data and power signals remain uncontaminated. The snap-in frame helps minimize the installation times and also provides extra security by firmly securing the insertable components in place. The contacts are plated in gold for optimal conductivity, and can have either a tin-lead or tin-only finish.

In conclusion, the AXN426530P rectangular connector is designed to provide high-density mezzanine interconnection for a variety of applications. It is designed with an array of 30 contacts and a 0.025-inch-pitch configuration that allows for high-speed signal transfer in addition to power and ground connections. The snap-in frame helps reduce time and effort when installing the connector, and the gold contact plating helps ensure reliable contact between components. With its high density, robust connection, and reliable contact setup, the AXN426530P is an ideal choice for a variety of applications.

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