Allicdata Part #: | 455-2660-ND |
Manufacturer Part#: |
B06B-ZESK-1D(T)(LF)(SN)(N) |
Price: | $ 0.46 |
Product Category: | Connectors, Interconnects |
Manufacturer: | JST Sales America Inc. |
Short Description: | CONN HEADER 6POS 1.5MM T/H |
More Detail: | Connector Header Through Hole 6 position 0.059" (1... |
DataSheet: | B06B-ZESK-1D(T)(LF)(SN)(N) Datasheet/PDF |
Quantity: | 3154 |
1 +: | $ 0.40950 |
10 +: | $ 0.38430 |
100 +: | $ 0.29453 |
500 +: | $ 0.25611 |
1000 +: | $ 0.21129 |
5000 +: | $ 0.18568 |
10000 +: | $ 0.17287 |
Series: | ZE |
Packaging: | Tray |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Outer Shroud Contact |
Pitch - Mating: | 0.059" (1.50mm) |
Number of Positions: | 6 |
Number of Rows: | 1 |
Row Spacing - Mating: | -- |
Number of Positions Loaded: | All |
Style: | Board to Cable/Wire |
Shrouding: | Shrouded - 4 Wall |
Mounting Type: | Through Hole |
Termination: | Kinked Pin, Solder |
Fastening Type: | Locking Ramp |
Contact Length - Mating: | -- |
Contact Length - Post: | 0.134" (3.40mm) |
Overall Contact Length: | -- |
Insulation Height: | 0.335" (8.51mm) |
Contact Shape: | Rectangular |
Contact Finish - Mating: | Tin |
Contact Finish Thickness - Mating: | -- |
Contact Finish - Post: | Tin |
Contact Material: | Copper Alloy |
Insulation Material: | Polyamide (PA66), Nylon 6/6, Glass Filled |
Features: | Board Guide |
Operating Temperature: | -25°C ~ 85°C |
Ingress Protection: | -- |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Natural |
Current Rating: | 2A |
Voltage Rating: | 100V |
Mated Stacking Heights: | 10.4mm |
Contact Finish Thickness - Post: | -- |
Applications: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
MarThe B06B-ZESK-1D(T)(LF)(SN)(N) is a high grade connector header belonging to JST\'s line of rectangular connectors. It offers a variety of mounting and contact arrangements, making it suitable for a wide range of applications. The B06B-ZESK-1D(T)(LF)(SN)(N) is designed primarily for use in consumer and market grade equipment, computer peripherals, and office automation.
The B06B-ZESK-1D(T)(LF)(SN)(N) features a 0.6mm pitch between the contacts, which is on the smaller end of the scale when compared to some other rectangular connectors. This allows it to be used in more compact and space-limited applications. The contact arrangement is 2.54mm square and the contact material is copper alloy with gold plating, which gives it good electrical performance and reliability. The male pin type is also easy to work with and fits well into wide range of device designs.
The B06B-ZESK-1D(T)(LF)(SN)(N) is a lead-free connector, which adheres to the European RoHS requirements and allows it to be used in applications that require lead-free components. In addition to the lead-free construction, it also has a number of other features that make it ideal for certain applications, such as the ability to lock the male pins in place with a locking mechanism, and the shortened mating height and depth. This makes the B06B-ZESK-1D(T)(LF)(SN)(N) a great choice for low-profile and space-limited applications.
When it comes to the working principle of the B06B-ZESK-1D(T)(LF)(SN)(N) connector, it is relatively straightforward. The connector consists of two separate parts: the male header pins and the female housing. The male header pins are inserted into the female housing, making contact with the copper alloy contacts and creating an electrical connection between the two. The locking mechanism then locks the pins in place to prevent them from coming loose or disconnecting. This ensures that the connection is reliable and secure.
Overall, the B06B-ZESK-1D(T)(LF)(SN)(N) is a great choice for applications requiring a high-grade rectangular connector. With its small pitch, lead-free design, and secure locking mechanism, it is a great option for many consumer and market grade equipment, computer peripherals, and office automation applications. The connector is easy to use and maintain, and provides reliable and secure connections for applications where space and lead-free components are required.
The specific data is subject to PDF, and the above content is for reference
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