| Allicdata Part #: | B60-075-VE-ND |
| Manufacturer Part#: |
B60-075-VE |
| Price: | $ 6.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Ohmite |
| Short Description: | HEATSINK FOR TO-247 TO-264 |
| More Detail: | Heat Sink TO-220, TO-247, TO-264 Aluminum Board L... |
| DataSheet: |  B60-075-VE Datasheet/PDF |
| Quantity: | 1000 |
| 25 +: | $ 5.90134 |
| Series: | B60 |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220, TO-247, TO-264 |
| Attachment Method: | Clip, Solder Foot |
| Shape: | Rectangular, Fins |
| Length: | 2.953" (75.00mm) |
| Width: | 2.530" (64.26mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.610" (40.89mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Degreased |
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Thermal – Heat Sinks provide a valuable service in the pursuit of prolonging the life and reliability of a variety of electric components and devices. The B60-075-VE is one of the many such heat sinks engineered to keep thermal-sensitive components cool. This particular Heat Sink is a 60 mm fan-cooled, three-heatpipe design, optimized to ensure low-noise operation, and offers a large heatsink area for heat dissipation.
The main application field for the B60-075-VE is in the cooling of temperature-sensitive components like motherboards, graphics cards, RAM Memory, and CPU on most standard and mid-size form factor chassis. It also works great for reducing the thermal loss on power supply components by constantly dissipating heat off of their surfaces.
The B60-075-VE can be broken down and referenced easily by understanding the engineering-level details of its internals. Each heatpipe is composed of four integral parts, separated by air chambers, and are part of the thermal conductive interface between the heating element and the cooling fins. This Heat Sink also employs a patented fanplate design which minimizes dust accumulation and noise levels while ensuring more efficient air penetration.
When installing the B60-075-VE, the unit should be placed directly in line with the airflow from the CPU fan, or as close to the temperature-sensitive components that need to be cooled as possible. Additionally, the fan should be mounted so that the airflow is directed away from those components, and the airflow should not be hampered by obstructing objects.
The B60-075-VE has been built to operate within a temperature range of 32°F to 140°F (0°C to 60°C), and includes an integrated, adjustable thermal control which helps to maintain the heat sink’s optimal temperature. Additionally, Heat Pipes disperse the heat generated by the components placed near it, and allow for the efficient transfer of this heat to the fins which serve as dissipaters.
The B60-075-VE is a great tool for anyone working on optimizing the cooling of temperature-sensitive components, providing a relative low-noise, high-efficiency solution. Through its patented fanplate, heatpipes, and optimized fin-design, the B60-075-VE has proven to be a reliable and dependable tool for keeping temperatures at a safe and optimal level on many different types of formats.
The specific data is subject to PDF, and the above content is for reference