BACC47EG1

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Backplane connectors, also called backplane interface connectors, are connectors specifically designed to mate together two or more printed circuit boards (PCB) in a robust manner so as to form a backplane. The BACC47EG1 backplane connector contacts are one such type of connectors suitable for use in applications requiring high mechanical strength, robustness, and reliable performance. This article provides an overview of the various application fields of BACC47EG1 backplane connector contacts and their working principles.

The Application Fields of BACC47EG1 Backplane Connector Contacts

BACC47EG1 backplane connector contacts are widely used for a number of applications, including high-speed systems, telecom servers, test instruments, distributed processing systems, and multimedia applications. These connector contacts are known for their high contact density and electrical performance, making them suitable for even demanding applications.

These backplane connector contacts can handle fast transmission speeds like low-voltage differential signal (LVDS) interfaces, such as SATA, SFP4 and QSFP. They are also reliable for applications such as 10G Ethernet, Serial Attached SCSI (SAS), and Fibre Channel (FC). BACC47EG1 backplane connector contacts are designed to be used in any system architecture requiring high contact capacity and retention force and hence are also perfect for use in high-performance applications.

The Working Principle of BACC47EG1 Backplane Connector Contacts

The workings of the BACC47EG1 backplane connector contact is based on the presupposition that when properly mated, these contacts will provide reliable and robust performance. The contacts are made of a combination of highly conductive pins and superior solderable housings or shells and are typically highly shielded and built to withstand harsh environmental conditions. These contacts also use a combination of specialized contact shape with a body to provide a secure and reliable connection.

The contact design surrounds an internal cavity in the form of a ‘cress-section’, which provides good electrical as well as thermal conduction characteristics. The contact foot is soldered to the PCB and its body surrounds the cavity, while the other contact parts are soldered into the backplane terminal array. The contact pins are precisely molded and inserted into the plastic housing. The contact pins are located inside this housing and the pins feature multiple contacts i.e. slots for a secure mating.

The BACC47EG1 backplane connector contacts are designed to provide a highly reliable and robust connection. They are also designed to reduce the amount of weight and the size of the end product, and are perfect for applications with harsh surroundings. The extremely high contact capacity and the retention force makes these connector contacts one of the most versatile and reliable connector contacts for use in various applications.

In conclusion, the BACC47EG1 backplane connector contacts are suitable for a wide range of applications, as they offer high contact density and reliable performance. Additionally, they are robust and resistant to harsh environmental conditions. The contact design provides a reliable and secure connection by means of multiple contacts and a cress-section cavity. With such a compact and reliable design, these connector contacts are perfect for applications requiring reliable and robust performance.

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