BFC2370CI274

Film Capacitors

Film capacitors (or dielectric film capacitors) are constructed out of alternating layers of metal foil and dielectric film. The dielectric material ranges from plastic film to paper or ceramic materials, and the metal foil is either made from aluminum or from stainless steel. The layers are pressed together under high temperature and pressure, with the dielectric material absorbing the metal and creating the electric fields needed for the capacitor.

BFC2370CI274 application field and working principle

The BFC2370CI274 is a high-performance, high-temperature dielectric film capacitor which can be used in a variety of electrical and electronic applications. The structure of BFC2370CI274 incorporates several layers of metal foil and dielectric materials, such as polypropylene, aluminum, mica, and tantalum. The capacitance of the BFC2370 CI274 is primarily determined by the thickness of the dielectric material, and it also has a wide operating temperature range, making it an ideal choice for applications where high temperatures and high voltage are encountered.

The working principle of the BFC2370CI274 is based on a configuration of two power supplies connected in series. When a voltage is applied, an electric field is created between the two power supplies, which in turn causes the diaphragm of the capacitor to move. The movement of the diaphragm results in a flow of electrons and ions which are responsible for the storage of electric energy in the device. The electric field also influences the speed at which the charge is stored in the capacitor, as it determines the rate at which the energy of the electrons is converted into electric energy stored in the device.

The BFC2370CI274 is suitable for applications requiring high capacitance, in such applications as ADSL, xDSL, and wireless communication systems. The BFC2370 can also be used in damping circuits to reduce the effects of shock and vibration, as well as in high-temperature AC applications. Other applications include harsh environment signal interfacing, circuit board decoupling, cathode ray tube displays, VLSI signal switches, medical equipment, and power supplies.