Allicdata Part #: | BGF110E6327XTTR-ND |
Manufacturer Part#: |
BGF110E6327XT |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Infineon Technologies |
Short Description: | IC FILTER HSMMC ESD PROT WLP-24 |
More Detail: | Filter, HSMMC with ESD Protection IC HSMMC (High S... |
DataSheet: | BGF110E6327XT Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | -- |
Packaging: | Tape & Reel (TR) |
Part Status: | Discontinued at Digi-Key |
Type: | Filter, HSMMC with ESD Protection |
Applications: | HSMMC (High Speed Multi Media Card) |
Mounting Type: | Surface Mount |
Package / Case: | 24-UFBGA, WLCSP |
Supplier Device Package: | WLP-24-2 |
Base Part Number: | BGF110 |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Specialized ICs have become a staple of modern electronics, and BGF110E6327XT is a perfect example of this. The device relies heavily on high-level system integration (HSI) technology and is capable of integrated radio-frequency (RF), analog and digital circuit design.
BGF110E6327XT has several distinct application fields. In the field of communication, it can be used in 4G/5G base stations, microwave backhaul and industrial wireless solutions. This IC is also used in IoT-related products, such as smart home sensors and network infrastructure. Additionally, the device has found its way into other markets, such as automotive, military, and medical.
The working principle of BGF110E6327XT is based on five core components: analog front-end, modem, baseband, processor, and power management. The analog front-end section is responsible for RF signal generation and reception, where it is later converted to digital format. The modem component then modulates and demodulates the signal, so it can be transferred in a communication network. The baseband component modifies the digital signal and optimizes it before sending it to the processor. The processor is responsible for controlling the overall system performance, while the power management component guarantees continuity within the IC.
With regards to advantages, the chip utilizes low-noise amplification topology in the analog frontend design and is equipped with several features that allow for increased signal-to-noise ratio (SNR) as well as enhanced immunity to interference. Moreover, the power management component also enables efficient energy use, which is beneficial for long-term usage.
In summary, the BGF110E6327XT is a highly specialized IC that can be found in multiple markets. It is capable of high-level system integration, relying on analog front-end, modem, baseband, processor, and power management components for efficient signal processing. Its advantages include low-noise amplification topology, as well as improved signal-to-noise ratio and immunity to interference.
The specific data is subject to PDF, and the above content is for reference
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