Allicdata Part #: | BGN-386B-ND |
Manufacturer Part#: |
BGN-386B |
Price: | $ 64.77 |
Product Category: | Uncategorized |
Manufacturer: | Omron Automation and Safety |
Short Description: | BOGEN NANO CLAMP |
More Detail: | N/A |
DataSheet: | BGN-386B Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 58.87980 |
Series: | * |
Part Status: | Active |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
BGN-386B stands for Bisphenol A-rich Glutaraldehyde Novelty-386B. It is a type of epoxy glue. It is a multifunctional adhesive suitable for a wide range of industrial applications. It is widely used in electrical, electronics, computing, telecommunications, aerospace, automotive, transportation and machine manufacturing industries.
BGN-386B is a two-part epoxy resin with a Bisphenol A-rich Glutaraldehyde composition. It is designed for use with cured epoxies that will not be exposed to excessively high temperatures. This means that it can be used in electronics and also in other applications where heat would damage the bond. The adhesive cures rapidly, is very strong, and provides excellent thermal conductivity to protect delicate circuitry.
BGN-386B is sold as a two-part kit containing a base and a curing agent. The base contains an epoxy resin, a curing agent, and a thermally conductive filler. The curing agent is a catalyst that causes the epoxy to cure. Once the components have been mixed, the adhesive will be ready to use within minutes. It quickly cures to a strong and tough bond.
The working principle of BGN-386B is quite simple. First, the base and curing agent are mixed in the appropriate ratio. Then, the mixture is applied to the surfaces that are to be joined. The adhesive bonds are formed by the curing agent as it reacts with the epoxy resin. This reaction releases heat, which accelerates the curing process and increases the strength of the bond. The curing process is usually complete within minutes, and the bond strength should be suitable for most applications.
The main advantages of BGN-386B are its fast curing speed, strong adhesion, and high thermal conductivity. The adhesive is able to provide a strong and reliable bond even in low temperatures. Additionally, the cured adhesive has excellent insulation properties. This makes it suitable for a variety of electronic applications, such as heat sinks, printed circuit boards, and LED and LCD displays.
BGN-386B is a reliable and versatile adhesive, making it suitable for many industrial applications. With its fast curing speed, strong adhesion, and thermal conductivity, it provides an ideal solution for bonding applications in a wide range of industries. From sensitive electronics to automotive parts, BGN-386B can provide the perfect solution.
The specific data is subject to PDF, and the above content is for reference
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