BKAD1-125-30002

Introduction to Backplane Connectors - ARINC

Backplane connectors have been a key part of the semiconductor industry for years, providing a low-cost, reliable connection that carries high data speeds and is highly reliable. ARINC is a type of backplane connection that is trusted for its ruggedness and reliability. The BKAD1-125-30002 model is a single-pair 23-position connector, which is used to provide a high-speed connection between a mother board and backplane, allowing the transfer of data and other signals. This type of backplane connection is typically used in mission-critical applications like communications, radar, defense electronics and aerospace applications.

Application Field of BKAD1-125-30002

The BKAD1-125-30002 backplane connector is an ideal choice for any application that requires a high-speed connection between a mother board and a backplane. This connector is specifically designed for use in the telecommunication, defense and aerospace industries. It is also suitable for other mission-critical applications, such as data and signal transmission.

The key advantage of this backplane connector is its ruggedness and reliability. The connector is designed to handle high-speed data transfers with minimal interference and signal attenuation. In addition, it is able to withstand extreme temperatures, vibration, and certain levels of electromagnetic interference.

The BKAD1-125-30002 connector is also used in embedded systems, where a single, reliable connection between a backplane and a mother board is essential. The high speed and robust nature of the connection makes it suitable for a variety of embedded systems, ranging from industrial automation systems to consumer electronics applications.

Working Principle of BKAD1-125-30002

The BKAD1-125-30002 connector operates according to a contact/mating system. This system consists of two separate elements: the contact and the mating. The contact element is a pin that is attached to the mother board. The mating element is a socket that is attached to the backplane.

When the connection is established, the two elements are connected by a metal spring. This spring creates an electrical connection between the two elements, allowing electrical signals to flow between them. The metal spring also provides a reliable mechanical connection, which prevents damage to the connection due to vibration, shock or temperature changes.

The BKAD1-125-30002 connector is designed to provide a high-speed data transfer between a mother board and backplane. The connector is designed to handle data speeds of up to 28 Gbps, making it an ideal choice for mission-critical applications. The connector is also designed to withstand extreme temperatures, vibration and electromagnetic interference, providing reliable, long-term operation in harsh environments.

Conclusion

Backplane connectors are an essential part of a variety of mission-critical applications in the semiconductor industry. The BKAD1-125-30002 model is a single-pair 23-position backplane connector that provides a high-speed connection between a mother board and a backplane. It is designed to handle data speeds of up to 28 Gbps, making it an ideal choice for mission-critical applications such as telecommunications, defense and aerospace applications. Additionally, the connector is designed to withstand extreme temperatures, vibration, and certain levels of electromagnetic interference.