BKAD2-313-30196

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Introduction to ARINC Backplane Connectors

ARINC backplane connectors are compliant with the open-architecture standards and abides by requirements laid out in MIL-45208. These connectors are designed for industrial applications with a flat-compact housing that allows protection against shock and vibration able to withstand outside force. The ARINC backplane connectors are available with several pin counts with a 2.54 mm pitch, allowing signals to travel up to 25,000 cycles, both insulated and non-insulated.

BKAD2-313-30196 Application Field and Working Principle

The BKAD2-313-30196 is an ARINC backplane connector designed to connect microprocessors and digital signal processors. This connector integrates data transfer rates of up to 156 Mbps over a transmission line. It can be used to create up to 24 low-signal density contacts with a pitch of 2.54mm per contact.

The BKAD2-313-30196 connector operates with parallel data transmission technology, which works by sending data as parallel bits over a single line. The connector utilizes differential signals in order to reduce noise and electromagnetic interference, and also to improve signal integrity. The pins of the connector are also plated with gold alloy that will enhance electrical conductance and provide a more reliable connection.

The BKAD2-313-30196 backplane connector has a low-signal density contact arrangement that is compliant with MIL-STD-1553 bus architecture. It has an insertion force of 6 to 10 tons and an axial insertion range of 2.5 mm. The connector is rated up to 300 V and has a current of up to 15 A for power applications. It can operate stably over the temperature range of -55°C to +105°C, making it suitable in a variety of applications.

Conclusion

BKAD2-313-30196 is a high reliable ARINC backplane connector which was designed for microprocessor/digital signal processor applications. Its transmission rate of up to 156 Mbps makes it an effective choice for connecting boards in a system setup. The connector also has a low-signal density contact arrangement compliant with MIL-STD-1553 bus architecture, a shock-proof/vibration resistant housing, and a temperature range range of -55°C to +105°C, which makes it ideal for a variety of applications.

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