BM23FR0.6-10DP-0.35V(895) Connectors, Interconnects

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The BM23FR0.6-10DP-0.35V(895) is a rectangular connectors - arrays, edge type, mezzanine (board to board) product. This product is useful for signaling applications due to its ability to link complex board configurations. It has an array of through-holes with a maximum pitch of 0.8mm, and is capable of handling signal speed data rates of up to 10Gbps. It features a range of hot-swap designs and a wide variety of mounting styles to ensure compatibility with different systems.

The BM23FR0.6-10DP-0.35V(895) is designed for high speed, high frequency applications such as 10GE PHY layers in the networking industry. It is ideal for designs that require high isolation and low crosstalk between components. The product meets tight signal integrity and EMC requirements, using shielding with a variety of configurations. The product is also compliant with ISO, IEC and UL standards.

The BM23FR0.6-10DP-0.35V(895) is a cost-effective solution for applications such as telecom and datacom switches, industrial automation systems and consumer electronics. It provides reliable and secure connectivity with up to 10Gbps signal transfer rates. It is also suitable for use in high density, ultra-high speed applications that require low reflection and low insertion loss.

The BM23FR0.6-10DP-0.35V(895)\'s working principle is based on its array of through-holes, connected via signal conductors to create a secure path for signal transmission. The shielding reduces crosstalk and minimizes signal reflections and insertion loss. The product also features a hot-swap design, allowing connections to be changed without disrupting normal operations.

The BM23FR0.6-10DP-0.35V(895) is a reliable and cost-effective solution for a variety of applications. It provides secure and reliable connections with up to 10Gbps signal speeds, along with shielding to reduce crosstalk and signal reflections. It is also compliant with various international standards and meets tight signal integrity and EMC requirements. The product is designed for easy installation and can be used in high density systems with ultra-high speed data rates.

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