BM23PF0.8-30DS-0.35V(51)

Series:	BM23
Packaging:	Tape & Reel (TR)
Part Status:	Active
Connector Type:	Receptacle, Center Strip Contacts
Number of Positions:	30
Pitch:	0.014" (0.35mm)
Number of Rows:	2
Mounting Type:	Surface Mount
Features:	Solder Retention
Contact Finish:	Gold
Contact Finish Thickness:	1.97µin (0.050µm)
Mated Stacking Heights:	0.8mm
Height Above Board:	0.031" (0.80mm)

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Introduction to BM23PF0.8-30DS-0.35V(51)

Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) is a type of interconnect which is used in a variety of applications. The BM23PF0.8-30DS-0.35V(51) is one of the most popular members of this family. It is a mezzanine connector, meaning that it sits between two PCBs and enables connections between them. It is a type of edge connector which utilizes an array of pins and is useful for connecting components to an application-specific HPC controller board.

Application Field & Working Principle

The BM23PF0.8-30DS-0.35V(51) rectangular connector offers superior performance in its class. It is designed for applications involving high data rates and an environment where there may be significant vibrations or high temperatures. It features a pin-connector array that is suitable for a wide variety of applications, such as high-performance computing, networking, and telecommunications. The pin-connector array consists of 30 pins that are arranged in three rows, each row containing 10 pins. The pins are arranged such that they form a 0.8 mm pitch between each row. This allows for an extremely compact design and makes the BM23PF0.8-30DS-0.35V(51) suitable for PCBs with limited space. In order to effectively connect the BM23PF0.8-30DS-0.35V(51) to the application-specific HPC controller board, the pins must be soldered to the board. This can be done using standard soldering techniques and the process is relatively straightforward. Once the pins have been soldered properly, the BM23PF0.8-30DS-0.35V(51) is ready to use. The BM23PF0.8-30DS-0.35V(51) is suitable for applications requiring transmission of high data rates without suffering from electromagnetic interference. This is because the connector features gold-plated contacts, which ensure reliable transmission of data. It is also designed to be fully compatible with the industry standard for mezzanine connectors, including the baseline pinouts developed by the PICMG consortium.

Conclusion

The BM23PF0.8-30DS-0.35V(51) is a highly reliable edge connector that is suitable for a variety of applications. Its pin-connector array is capable of supporting high data rates without suffering from electromagnetic interference. The connector is also designed to be fully compatible with the industry standard for mezzanine connectors, making it an excellent choice for applications requiring a reliable and cost-effective solution.

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