BMB2A0470LN2

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Ferrite beads and chips are found in many electronic components, including BMB2A0470LN2. In most cases, the beads and chips are used to reduce and partially eliminate or filter out high frequency electromagnetic interference (EMI). By helping to reduce EMI, these bead and chip components protect other components by regulating current on a circuit and providing a short circuit path for the noise.

The BMB2A0470LN2 is a surface mount ferrite bead that reduces and filters in the MHz range. It is a high-performance multi-layer monolithic ceramic chip bead with a low-cost that is well suited for mobile phones, wireless LAN, automotive electronics, receivers, and data communication devices. It has an enhanced solderable termination and enables high-speed assembly. The bead’s high-frequency characteristics are also ideal for high-density applications. It features a ceramic-filled polyimide with firm binding between ferrite and polyimide layers, giving it excellent mechanical strength, high thermal shock resistance, and good shock performance.

BMB2A0470LN2’s two-layer chip structure offers improved frequency characteristics and a lower Series Inductance, making it an ideal choice for a wide range of applications, including:

• Cellular Phones
• Digital Home Appliances
• Base Stations
• Industrial Equipment
• Consumer Electronics

The working principle of the BMB2A0470LN2 consists of a series of interconnected ferrite chips and beads, which are made from a combination of magnetic materials and electrical conductors. These beads are separated by a dielectric material such as polyimide. When a current passes through this bead structure, the magnetic field generated by the current causes the electrical field to travel across the dielectric, creating an electrical stress. This stress affects the device’s behavior, allowing the bead to reduce interference from external sources and regulate the amount of current that passes through it.

The BMB2A0470LN2 is a high-frequency protection device that reduces EMI and improve electromagnetic compatibility in many electronic applications. Its high-frequency characteristics, firm binding between ferrite and polyimide layers, and enhanced solderable termination make it an ideal choice for a wide range of electronic components. By reducing EMI, the device also helps to protect other components by providing a short circuit path for the noise, reducing current on a circuit, and regulating its amount.

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