BOM-HS-01 Allicdata Electronics
Allicdata Part #:

BOM-HS-01-ND

Manufacturer Part#:

BOM-HS-01

Price: $ 2.41
Product Category:

Fans, Thermal Management

Manufacturer: Sunon Fans
Short Description: HEATSINK
More Detail: Heat Sink
DataSheet: BOM-HS-01 datasheetBOM-HS-01 Datasheet/PDF
Quantity: 992
1 +: $ 2.18610
10 +: $ 2.00151
25 +: $ 1.81994
50 +: $ 1.68336
100 +: $ 1.50135
250 +: $ 1.43310
500 +: $ 1.34212
Stock 992Can Ship Immediately
$ 2.41
Specifications
Series: *
Part Status: Active
Description

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Thermal - Heat Sinks

Thermal management is an important part of any design. Heat sinks are the most common way to dissipate heat and extend the life of any electronic device or component. Heat sinks are designed to absorb heat generated by a device, such as a laptop, and disperse it into the surrounding environment. Heat sinks can be made from aluminum, copper, or other metals, and are available in a variety of sizes and shapes. The BOM-HS-01 heat sink is an example of a popular heat sink, and this article will explain the application fields and working principles of this product.

Application Field

The BOM-HS-01 heat sink is designed for use in applications that require efficient heat dissipation, such as LED lighting fixtures, computers, gaming consoles, and other electronic devices. This heat sink is also suitable for applications where the ambient temperature is high or where the device produces high levels of thermal power. This heat sink can also be applied in areas where high-power LED lighting is used, such as stadiums, large halls, and other public venues.

Working Principle

The BOM-HS-01 heat sink works by absorbing the thermal energy generated by a device and then dissipating it into the surrounding environment. This is done through the application of a heat transfer fluid such as air or water. The heat absorption is accomplished by the heat sink material, which consists of either aluminum or copper. Aluminum absorbs and dissipates heat much faster than copper, making it the ideal material for heat sinks designed to absorb large amounts of heat.

The heat sink material is then joined to a large mass, such as a copper plate, in order to dissipate heat efficiently. The process of heat transfer from the heated device to the heat sink is known as conduction. The device\'s heat is gradually absorbed by the heat sink material and then dissipated into the water or air that surrounds it. The heat is then gradually released into the atmosphere, effectively reducing the temperature of the device or component.

The BOM-HS-01 heat sink is a highly efficient product that can be used in a variety of applications, from LED lighting fixtures to gaming consoles. With its efficient heat dissipation and its ability to absorb large amounts of thermal energy, this heat sink is one of the best solutions for managing heat produced by any electronic device or component.

The specific data is subject to PDF, and the above content is for reference

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