BPS8B96KKD200ECLF

The BPS8B96KKD200ECLF is a medium density backplane connector with a unique design that allows for a wide range of applications. The connector is a DIN 41612-compliant connector, meaning it is designed to meet standards requirements for high-density interconnects. This type of connector is a popular choice for board-level applications in consumer electronics, telecommunications, industrial automation, and medical devices.

The BPS8B96KKD200ECLF is a robust and reliable connector made of a tin-zinc alloy with a corrosion-resistant nickel-plated finish. It is designed for use in medium-density environments with up to 50 lines. It features a double leaf spring retention method that effectively mitigates insertion forces, making the connection process easier. Additionally, the connector performs accurately and reliably despite vibrations or shock.

The BPS8B96KKD200ECLF connector uses a pin-grid topology that allows for high insertion and withdrawal cycles, making it well-suited for board-level interconnects. The pin-grid topology also ensures a secure connection that resists dust, dirt, and other contaminants. Additionally, the connector is capable of reliable transmission of signal at data rates up to 800Mbps.

The working principle of the BPS8B96KKD200ECLF is based on the mechanical interconnection of two mating elements, the interface elements and the mating elements. The interface elements are connected to the mating elements through the connector’s unique compression force feature. This feature not only makes for a secure connection but also ensures the efficient transmission of signal between the two parts, resulting in reliable performance.

The connector also benefits from its size, which is only 7.5mm x 7.8mm x 6.6mm, making it one of the most compact high-density connectors on the market. This makes it ideal for applications with limited space and a high level of connectors. The BPS8B96KKD200ECLF is also easy to install and is RoHS-compliant.

The BPS8B96KKD200ECLF is a versatile connector that is well-suited for a variety of applications, both industrial and consumer. It is designed for use in board-level interconnects in consumer electronics, telecommunications, industrial automation, and medical devices, as well as numerous other applications. Its high-density design, reliable performance, and secure signal transmission make it a great choice for many device designers.