BRCG064GWZ-3E2 Integrated Circuits (ICs) |
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Allicdata Part #: | BRCG064GWZ-3E2TR-ND |
Manufacturer Part#: |
BRCG064GWZ-3E2 |
Price: | $ 0.25 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | ROHM Semiconductor |
Short Description: | IC EEPROM 64K I2C UCSP35L1 |
More Detail: | EEPROM Memory IC 64Kb (8K x 8) I²C 400kHz UCSP35L... |
DataSheet: | BRCG064GWZ-3E2 Datasheet/PDF |
Quantity: | 1000 |
6000 +: | $ 0.22340 |
12000 +: | $ 0.21954 |
Series: | -- |
Packaging: | Tape & Reel (TR) |
Part Status: | Active |
Memory Type: | Non-Volatile |
Memory Format: | EEPROM |
Technology: | EEPROM |
Memory Size: | 64Kb (8K x 8) |
Clock Frequency: | 400kHz |
Write Cycle Time - Word, Page: | 5ms |
Memory Interface: | I²C |
Voltage - Supply: | 1.6 V ~ 5.5 V |
Operating Temperature: | -40°C ~ 85°C (TA) |
Mounting Type: | Surface Mount |
Package / Case: | 36-XFBGA, CSP |
Supplier Device Package: | UCSP35L1 |
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Introduction
The BRCG064GWZ-3E2 is a memory module designed for embedded system applications. It is a complete, 3rd-generation(3G) memory component, combining embedded non-volatile memory (NVM) technology, with high-speed SRAM and DRAM storage operations. The BRCG064GWZ-3E2 is ideal for applications that require large amounts of data storage, high-speed manipulation of data files, and very low power consumption.
Applications
The BRCG064GWZ-3E2 has a wide variety of potential applications. The 3G memory component provides high throughput and low power consumption, making it ideal for situations where speed and efficiency are paramount. It is often used in mobile device applications, embedded systems, where the component is placed close to the processor and operates continuously. Additionally, The BRCG064GWZ-3E2 can be used in applications where large amounts of data such as maps and pictures need to be stored and/or edited quickly.
Working Principle
The BRCG064GWZ-3E2 works by taking advantage of the latest memory technologies. The component is composed of the low power SRAM, the low-latency DRAM, a controller, and both embedded NVM. The SRAM and DRAM employ pipelined architecture, making it ideal for high random-access operation as well as burst operations. The embedded NVM provides non-volatile storage capabilities, allowing data to be stored even when power is no longer available.
The controller maintains an efficient and effective synchronising between the SRAM, DRAM and NVM. When fetching data from the NVM, the controller first reads the data and stores it in the DRAM. The data stored in the DRAM is then moved to the SRAM, where it can be accessed more quickly. Likewise, when writing data, the controller moves the data from the SRAM to the DRAM which is then written to the NVM.
In operation, the BRCG064GWZ-3E2 can recognise, store and manage data from any source such as hard disk, flash memory, peripheral devices or from the network. It ensures quick, secure and reliable storage operations. Additionally, the BRCG064GWZ-3E2 has an integrated error correction code (ECC) technology, allowing it to identify and repair data corruptions quickly.
Conclusion
In conclusion, the BRCG064GWZ-3E2 is an advanced, 3rd-generation memory component designed for a wide range of embedded system applications. It combines non-volatile memory, high-performance SRAM and DRAM into a single chip, enabling quick data storage and access, as well as low power consumption. The advanced error correction capabilities and integrated ECC technology ensure reliable, secure storage operations.
The specific data is subject to PDF, and the above content is for reference
Part Number | Manufacturer | Price | Quantity | Description |
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BRCG064GWZ-3E2 | ROHM Semicon... | 0.25 $ | 1000 | IC EEPROM 64K I2C UCSP35L... |
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