BU140Z-178-HT Allicdata Electronics
Allicdata Part #:

ED2203-ND

Manufacturer Part#:

BU140Z-178-HT

Price: $ 1.58
Product Category:

Connectors, Interconnects

Manufacturer: On Shore Technology Inc.
Short Description: CONN IC DIP SOCKET 14POS GOLD
More Detail: N/A
DataSheet: BU140Z-178-HT datasheetBU140Z-178-HT Datasheet/PDF
Quantity: 113
1 +: $ 1.43010
10 +: $ 1.29528
25 +: $ 1.21565
50 +: $ 1.16285
100 +: $ 1.11000
250 +: $ 1.00430
500 +: $ 0.92500
1000 +: $ 0.79286
2500 +: $ 0.74000
Stock 113Can Ship Immediately
$ 1.58
Specifications
Termination: Solder
Contact Resistance: 7 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.059" (1.50mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: Flash
Contact Finish - Post: Copper
Pitch - Post: 0.100" (2.54mm)
Series: BU-178HT
Features: Open Frame
Mounting Type: Surface Mount
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 78.7µin (2.00µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The BU140Z-178-HT is a socket that is designed for ICs and transistors. This socket is able to be used with most ICs and transistors, allowing for easy insertion and removal of components from a circuit board. This makes it an ideal solution for prototyping, repair, and replacement applications. In addition, the socket can be soldered to the circuit board or mounted directly to a DIN rail.

The BU140Z-178-HT is made of high-quality, durable plastic, which makes it a reliable and dependable solution for high-voltage applications. The socket is designed with a 25 mm spacing between pins, which allows for a large amount of flexibility in component placement. This feature also ensures that the socket can be adjusted to fit different types of components, depending on the application.

The socket also features a unique heat shrink tube design, which offers additional flexibility and protection to the components. The heat shrink tubing encases the pins, ensuring a tight connection between the socket and the component, without any risk of shorting or damage to the components. The heat shrink tubing also prevents the pins from becoming loose or misaligned.

The BU140Z-178-HT is a multipurpose, reliable socket that can be used for both ICs and transistors. Its versatile design makes it applicable to a variety of applications. It is an ideal choice for high-voltage and high-frequency applications, as well as for prototyping, repair, and replacement of components.

The working principle of the BU140Z-178-HT is quite simple. It is a plug-and-play socket, meaning that it requires no additional assembly or wiring. When a component is inserted in the socket, it makes contact with the pins inside the socket, allowing for an electrical connection between the two. This connection allows current to flow through the socket and the component, enabling the circuit to work as intended.

In addition to its easy use, the BU140Z-178-HT also provides strong electrical insulation, preventing any stray electrical current from being conducted into other components in the circuit. This is an important factor for ICs and transistors operating in high-voltage applications. The socket also features a robust metal shell, providing additional protection for the component.

The BU140Z-178-HT is a versatile and reliable socket that can be used for ICs and transistors, in a wide variety of applications. Its plug-and-play design and strong insulation make it an ideal choice for prototyping, repair, and replacement applications. With its durable design and heat shrink protection, the BU140Z-178-HT is a reliable solution for high-voltage and high-frequency applications.

The specific data is subject to PDF, and the above content is for reference

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