BU180Z-178-HT

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BU180Z-178-HT is a family of electrically operated sockets for IC\'s, transistors, and other semiconductors. The three-row design offers a range of feature sizes, contact arrangements, and operating temperatures to meet most applications. The BU180Z-178-HT family includes products with adhesive and non-adhesive base materials, and are designed to mount to a variety of chassis or circuit boards.

Application Areas and Functionality

The BU180Z-178-HT socket family can be used in a variety of applications including automotive, consumer electronics, and industrial, medical, and military applications. The BU180Z-178-HT socket is suitable for ICs, transistors, and other semiconductors. It has the capability to mount parts sized between 0.25 inch and 2.5 inch and the option of single, double, or triple rows. This socket has the ability to mount the parts securely and handle power dissipation up to 6A.

Working Principle

BU180Z-178-HT sockets use an electrical contact system, called “cantilever spring technology”, that provides a secure contact between the device under test and the device socket. The electrical contact system is designed to ensure both maximum contact area and high pressure for maximum power dissipation. A metal spring is used to mates the two contacts, making sure a secure contact between the parts. The spring also ensures that the parts are tightly mated.

The cantilever spring technology enhances the electrical contact by providing a continuous electrical path between the contacts while minimizing the number of contact points that may be affected by vibration or oxidation over time. This electrical contact system ensures that the parts are securely connected and eliminates the chance of poor connectivity due to loose contact points. The BU180Z-178-HT socket is designed to carry up to 6A of power and is rated for use in ambient temperatures of up to 85C.

Conclusion

The BU180Z-178-HT is a family of electrically operated sockets for IC\'s, transistors, and other semiconductors, and is suitable for a range of applications. By using a cantilever spring technology, the BU180Z-178-HT socket provides a secure contact between the device and the socket while ensuring maximum power dissipation. The BU180Z-178-HT socket is rated for use in ambient temperatures of up to 85C and can handle power dissipation up to 6A.

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