BU220Z-178-HT

BU220Z-178-HT is a type of sockets for ICs, transistors, and other electronic components. Compared to traditional types of sockets, it has excellent performance. Moreover, it can reduce circuit circuit noise, interpoltion of power supply and reduce thermal energy consumption. In addition, it is cost-effective and can be used in a variety of applications.

The BU220Z-178-HT socket is a thermal cross-connected compression type socket , which is designed to be able to release and distribute stress forces away from the IC device during high-speed operations. With this structure, the socket can ensure the reliable and safe connection of IC components during operations, reduce the risk of point-to-point contact issues on the IC device, and protect it from additional mechanical damage from high-speed operations. In addition, The mounting structure of BU220Z-178-HT is stable and reliable; it features a high level of installation precision, providing a strong physical protection even at high operating temperatures.

In terms of its application field, the BU220Z-178-HT socket can be used in a variety of fields including consumer electronics, automotive, communication, aerospace, military, medical, and other industrial and commercial applications. In consumer electronics, it can be used for memory sockets, processor sockets, motherboard sockets, optical component platforms, and integrated circuit (IC) applications. In automotive applications, it can be used for electric power systems and heat dissipation systems. In communications and aerospace, it can be used for radar and satellite systems. In military and medical, it can be used for missile and biological systems. Finally, in other industrial and commercial applications, it can be used for computer, radio and television system, and power supply.

In terms of its working principle, the BU220Z-178-HT socket is designed to be able to reduce circuit noise, interpolation of power supply and reduce thermal energy consumption. This is made possible through its thermal cross-connected compression type structure. This structure works by releasing stress forces away from the IC device during high-speed operations. The structure also helps to improve the reliability of connections, reduce current leakage, and reduce contact resistance. In addition, the structure has improved thermal performance and insulative properties.

The BU220Z-178-HT socket is an excellent choice for ICs, transistors, and other electronic components. It is cost-effective, increases reliability, reduces circuit noise, reduces power supply interference, and reduces thermal energy consumption. It can be used in a variety of applications, including consumer electronics, automotive, communication, aerospace, military, medical, and other industrial applications.