C60-075-VE

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Thermal - heat sinks are a type of component used in the thermal management of electrical systems and provide the capability to manage heat generation due to current carrying components in an electrical system. The C60-075-VE is an example of a thermal-heat sink which has great potential applications due to its compact size and low-profile design. This product is a plate-fin heat sink that is ideally suited for applications requiring downward airflow, such as LED lighting and other low-profile applications.

The C60-075-VE utilizes a forced-air convection design to provide thermal management of LED lights, AC delivered components, and other high-power semiconductor devices. The unique physical design of the C60-075-VE incorporates a large number of radially distributed fin structures that provide a better accordance of flow within the device than conventional fins usually used in thermal-heat sinks. The optimized fin design creates a repeatable cooling environment that is suited for multiple products.

The C60-075-VE Heat Sink has a maximum power rating of 30W and a thermal resistance as low as 0.38°C/W when tested in an open environment and with an air flow of 100L/min. It is designed to be small for a product of its kind, measuring only 60 x 75 x 16mm. The C60-075-VE is provided with large mounting tabs, making it well-suited for various backplanes and other LED lighting configurations. The device can also be easily customized to meet the needs of specific customer applications, making it useful for a variety of applications. Additionally, the C60-075-VE has an easy-to-mount, single-piece design that makes it a cost-effective solution for thermal management.

The C60-075-VE Heat Sink utilizes a unique airflow configuration that takes advantage of the heat sink’s fin structure to provide long-term cooling performance. The airflow is managed using a combination of vertical and horizontal fins, which are arranged in such a way as to maximize the cross-sectional area available to the air. This airflow is then guided by a series of troughs designed to increase the rate of convection and reduce the pressure drop across the unit. The resulting effect is a low-pressure environment that allows for optimal conduction of heat energy away from the semiconductor devices.

The C60-075-VE Heat Sink is also designed to maintain its low-profile design and maintain the optimal airflow condition through its entire operating temperature range. By utilizing a reduced height, the C60-075-VE is able to be mounted in even the most space-constrained locations. The product is also equipped with optional end caps that can further decrease the size of the unit. Additionally, the C60-075-VE Heat Sink also features two thermistor mounting clips to measure the actual temperature of the heatsink.

Overall, the C60-075-VE Heat Sink is a very useful device for thermal management applications. It uses a unique design to maximize the cross-sectional area available to the air, and its low-profile design makes it suitable for various backplanes and other LED lighting configurations. The unit is also highly customizable to meet various customer requirements. Finally, it utilizes a combination of vertical and horizontal fins to maintain a low-pressure environment that allows for optimal conduction of heat energy away from the semiconductor devices, resulting in improved thermal management of the system.

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